Day one
NGMM: The Future is 3DHI
Whitney Mason, MTO director, presented, "NGMM: The future is 3DHI."
Keynote
Lt. Gen. Miles Brown, U.S. Army, delivered a keynote.
NGMM Program Update and Accomplishments
Michael Holmes, NGMM managing director, discussed NGMM's progress and accomplishments.
TNC Overview
Dwayne LaBrake, CEO, Texas Institute for Electronics (TIE), provided an overview of the TIE NGMM Center (TNC).
TNC Technology Roadmap
S.V. Sreenivasan, CTO, TIE, presented the TNC technology roadmap.
TNC Ecosystem Update
Jaydeep Kulkarni, executive director of advanced packaging design, TIE, provided an update on the TNC ecosystem.
Workforce Development
Alyssa Reinhart, director workforce development, TIE, discussed workforce development and NGMM.
TNC Research Activities Update
Ted Moise, director, North Texas Semiconductor Institute, spoke to recent TNC research activities.
The Quest for 3D Hybrid Bonding
Jan Vardaman, president, TechSearch International, presented, "Quest for 3D Hybrid Bonding: Challenges for the Next Steps."
Day two
Heterogeneous Integration in Analog Technologies
Sameer Pendharkar, VP, technology development, Texas Instruments, discussed heterogeneous integration in analog technologies.
Economics and sustainability
Mina Kim, NGMM senior economist, discussed the economics and sustainability imperative behind NGMM.
Tech policy and the semiconductor ecosystem
Tim Lee, president, IEEE-US, presented on the intersection of US tech policy and the global semiconductor ecosystem.
Engagement opportunities
Michael Holmes, NGMM managing director, closed with an overview of NGMM engagement opportunities.
