Intrachip/Interchip Enhanced Cooling (ICECool) The increased density of electronic components and subsystems in military electronic systems exacerbates the thermal management challenges facing engineers. The military platforms that host these systems often cannot physically accommodate the large cooling systems needed for thermal management, meaning that heat can be a limiting factor for performance of electronics and embedded computers.
DARPA introduced the Intrachip/Interchip Enhanced Cooling (ICECool) program in June 2012 to explore embedded thermal management. The premise of ICECool was to bring microfluidic cooling inside the substrate, chip, or package, including thermal management in the earliest stages of electronics design. The program helped create a research community intent on developing techniques and technologies for including new thermal control innovations in the overall quest to continue progress in electronics technologies.
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