HAPPI: Heterogeneous Adaptively Produced Photonic Interfaces

The Heterogeneous Adaptively Produced Photonic Interfaces (HAPPI) program aims to revolutionize information transmission within microsystems by achieving a 1000x increase in connectivity density through advanced photonic solutions. 

The program focuses on developing three-dimensional optical routing capabilities both within and between chips, enabling unprecedented levels of information movement and processing throughout integrated systems. 

This includes the potential to interface with both electronics and other optical elements, enhancing the flexibility and reach of the system. 

HAPPI is addressing fundamental challenges in photonic integration, such as improving out-of-plane waveguiding, mode conversion, and robust chip-to-chip connections, while maintaining high efficiency across large arrays of optical links. 

The program is developing efficient, high-density photonic links that dramatically increase photonic routing density within the microsystem. These links integrate diverse materials and fabrication techniques for scalable, cost-efficient manufacturing, and incorporate robust optical interfaces that maintain high performance despite manufacturing and environmental variations. 

HAPPI’s advancements will enable large-scale photonic circuits with thousands of components, unlocking new microsystem architectures for applications such as signal processing, free-space communications, remote sensing, digital computing, and atomic sensing. 

More broadly, the program aims to inspire a domestic ecosystem for advanced photonic integration, encompassing foundry services, automated design tools, and advanced packaging technologies.