The Microsystems Technology Office is holding a Proposers Day to provide information to potential proposers on the objectives of the new Photonics in the Package for Extreme Scalability (PIPES) program. PIPES will develop optical I/O for emerging data movement needs of commercial and military systems. PIPES seeks to emplace integrated optical transceiver capabilities into cutting-edge multi-chip modules (e.g., field-programmable gate arrays (FPGAs), graphical processing units (GPUs), central processing units (CPUs), and application-specific integrated circuits (ASICs)) for 2023-era microelectronics with performance well beyond currently available solutions. In parallel, PIPES aims to develop novel optical I/O approaches and advanced optical packaging and switching technologies to satisfy data movement demands of highly parallel systems in the 2028 timeframe. Additionally, the program will combine the advanced microelectronics capabilities of commercial industry, innovative photonics solutions from research communities, and DoD-specific application drivers from the defense industry into a framework for long-term technology availability by establishing and supporting a domestic technology ecosystem.
Additional details, including registration instructions, are available at https://go.usa.gov/xPPSy. The registration deadline is 4:00 PM ET on October 26, 2018.
Please address administrative questions to DARPA-SNemail@example.com, and refer to the PIPES Proposers Day (DARPA-SN-19-04) in all correspondence.
DARPA hosts Proposers Days to provide potential performers with information on whether and how they might respond to the Government’s research and development solicitations and to increase efficiency in proposal preparation and evaluation. Therefore, the PIPES Proposers Day is open only to registered potential applicants, and not to the media or general public.
DARPA anticipates sharing additional program details in a forthcoming Broad Agency Announcement to be posted to the Federal Business Opportunities website.
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