On June 1, 2017, the DARPA Microsystems Technology Office (MTO) announced a new Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. The ERI will draw on new and existing DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Building on the tradition of other successful government-industry partnerships, the ERI aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and the DoD.
Moore’s Law, defined on pages one and two of Gordon Moore’s seminal 1965 paper entitled “Cramming More Components onto Integrated Circuits,” has guided the electronics industry for more than 50 years. The continued realization of this Law, however, is challenged on both technical and economic grounds. Page three of Moore’s paper described research areas required to manage this possibility. As part of the ERI and in deference to Moore’s ideas, MTO’s ERI Page 3 Investments will support research and development in each of these areas: Architectures, Design, and Materials and Integration. To fully unlock microelectronics innovation and maintain DoD’s technical superiority, programs within these Page 3 thrust areas will foster the environment needed for the next wave of U.S. semiconductor advancement.
Each thrust area will support two separate programs that operate independently of each other.
Architectures: Can we enjoy the benefits of specialized circuitry while still relying on general programming constructs through the proper software/hardware co-design?
Design: Can we dramatically lower the barriers to modern system-on-chip design and unleash a new era of circuit and system specialization and innovation?
Materials & Integration: Can the integration of unconventional materials enhance conventional silicon circuits and continue the progress traditionally associated with scaling?
ERI aims to more constructively enmesh the technology needs and capabilities of the defense enterprise with the commercial and manufacturing realities of the electronics industry. To facilitate collaboration between defense and commercial entities, DARPA will publish a regularly updated list of groups interested in teaming on proposals or research. Links to the BAAs and other proposal resources are located in the resources column.
The ERI Page 3 Investments are the next steps in creating a national electronics capability that will provide a foundational contribution to U.S. economic and national security interests. DARPA is eager to work collaboratively with entities that will further the broader cause of the electronics industry while simultaneously advancing national defense.
To jump-start innovation and foster forward-looking collaborations across the U.S. electronics community, DARPA will host an ERI Summit over three days, bringing together those most impacted by the coming inflection in Moore’s Law. For more information, please visit: www.ERI-summit.com
For general inquiries, including eligibility and participation, please reach out to ERI_page3@darpa.mil. Media questions and requests should be directed to firstname.lastname@example.org.
You are now leaving the DARPA.mil website that is under the control and
management of DARPA. The appearance of hyperlinks does not constitute
endorsement by DARPA of non-U.S. Government sites or the information,
products, or services contained therein. Although DARPA may or may not
use these sites as additional distribution channels for Department of
Defense information, it does not exercise editorial control over all of
the information that you may find at these locations. Such links are
provided consistent with the stated purpose of this website.
After reading this message, click to continue