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Defense Advanced Research Projects AgencyWork With Us

DARPA Electronics Resurgence Initiative

Page Last Updated 06/20/19

On June 1, 2017, the DARPA Microsystems Technology Office (MTO) announced a new Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. ERI draws on new and existing DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Building on the tradition of other successful government-industry partnerships, ERI aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and the DoD to create a more specialized, secure, and heavily automated electronics industry that serves the needs of both the domestic commercial and defense sectors.

ERI Overview and Structure

 

Moore’s Law, defined on pages one and two of Gordon Moore’s seminal 1965 paper entitled “Cramming More Components onto Integrated Circuits,” has guided the electronics industry for more than 50 years. The continued realization of this Law, however, is challenged on both technical and economic grounds. Page three of Moore’s paper described research areas required to manage this possibility. In deference to Moore’s ideas, ERI investments are organized into the areas he described - Architectures, Designs, and Materials and Integration:

  • The Architectures Thrust asks whether the electronics community can enjoy the benefits of specialized circuitry while still relying on general programming constructs through the proper software/hardware co-design
  • The Designs Thrust asks whether the electronics community can dramatically lower the barriers to modern system-on-chip design and unleash a new era of circuit and system specialization and innovation
  • The Materials and Integration Thrust asks whether the integration of unconventional materials can enhance conventional silicon circuits and continue the progress traditionally associated with scaling

In July 2018, DARPA officially kicked off six “Page 3” programs aligned to these thrust areas. In November 2018, DARPA announced the initiation of ERI Phase II, which builds on the existing ERI thrusts areas to address issues regarding enforcing electronics security and privacy; provide access to differentiated electronics capabilities; and maximize the impact of ERI investments on national defense applications. Today, ERI encompasses over 19 programs, including eight foundational programs that lay the Initiative’s early groundwork; six “Page 3” programs that call for new approaches to microelectronics materials and integration, architectures, and designs; and six “Phase II” programs that emphasize electronics security and privacy, differentiated capabilities from domestic suppliers, and novel defense applications. By drawing on the recommendations found in Gordon Moore's seminal 1965 paper and building on the tradition of successful government-industry partnerships, ERI is working to create a more specialized, secure, and heavily automated electronics industry that meets the needs of both the national defense community as well as the domestic commercial industry.

Working with ERI

ERI aims to more constructively enmesh the technology needs and capabilities of the defense enterprise with the commercial and manufacturing realities of the electronics industry. To facilitate collaboration, this page will provide regular updates on ERI-related broad agency announcements, programs, and events. One such event is the second annual ERI Summit, June 15 – 17, in Detroit. It will feature leading voices, 11 collaboration workshops, and 14 DARPA Program Managers.

ERI’s investments are the next steps in creating a national electronics capability that will provide a foundational contribution to U.S. economic and national security interests. DARPA is eager to work collaboratively with entities that will further the broader cause of the electronics industry while simultaneously advancing national defense. For general inquiries, including eligibility and participation, please reach out to ERI_page3@darpa.mil. Media questions and requests should be directed to outreach@darpa.mil.

 

Tags

| Algorithms | Complexity | Contracts | Cost | Decentralization | Electronics | Globalization | Integration | Manufacturing | Materials | Microchips | Microsystems | Tech-Foundations |

 

Offices

Advanced integrated circuitry.

Microsystems Technology Office

The Microsystems Technology Office’s (MTO) core mission is to develop high-performance intelligent microsystems and next-generation components to ensure U.S. dominance in the areas of Command, Control, Communications, Computing, Intelligence, Surveillance, and Reconnaissance (C4ISR), Electronic Warfare (EW), and Directed Energy (DE). The effectiveness, survivability, and lethality of these systems depend critically on the microsystems contained inside.
| Agency | Decentralization | Electronics | EW | Globalization | Microsystems | Mobile | Photonics | PNT | Spectrum |

Similarly    Tagged    Content

DARPA Announces ERI Summit 2019 Workshops
DARPA Announces Second Annual ERI Summit
Bringing Advanced Microelectronics to Revolutionary Defense Applications
DARPA Announces Next Phase of Electronics Resurgence Initiative
Electronics Resurgence Initiative Summit

OPEN OPPORTUNITIES

No open ERI opportunities, as of the last page update.

ONGOING ERI PROGRAMS

Phase II

Automatic Implementation of Secure Silicon (AISS)

Digital RF Battlespace Emulator (DRBE)

Guaranteed Architectures for Physical Security (GAPS)

Photonics in the Package for Extreme Scalability (PIPES)

Real Time Machine Learning (RTML)

Technologies For Mixed-Mode Ultra Scaled Integrated Circuits (T-MUSIC)

Page 3

Three Dimensional Monolithic System-on-Chip (3DSOC)

Foundations Required for Novel Compute (FRANC)

Software Defined Hardware (SDH)

Domain-Specific System on Chip (DSSoC)

Intelligent Design of Electronic Assets (IDEA)

Posh Open Source Hardware (POSH)

Foundational

Circuit Realization At Faster Timescales (CRAFT)

Compact Heterogeneous Integration and IP Reuse Strategies (CHIPS)

Hierarchical Identify Verify Exploit (HIVE)

Millimeter Wave Digital Arrays (MIDAS)

Near Zero Power RF and Sensor Operations (N-ZERO)

Joint University Microelectronics Program (JUMP)

Lifelong Learning Machines (L2M)

System Security Integrated Through Hardware and Firmware (SSITH)

RESOURCES

Events Calendar

ERI Summit 2019
July 15-17, 2019

Past Events

ERI In the News

DARPA Announces ERI Summit 2019 Workshops (5/31/19)

DARPA Announces Second Annual ERI Summit (4/5/19)

DARPA Seeks to Make Scalable On-Chip Security Pervasive (3/25/19)

Additional Information

Gordon Moore’s seminal 1965 paper

Contracting Guidance (pending)

ERI Performer List

 

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Selected DARPA Achievements

DARPA collaborated with industry on stealth technology.
DARPA’s Stealth Revolution
In the early days of DARPA’s work on stealth technology, Have Blue, a prototype of what would become the F-117A, first flew successfully in 1977. The success of the F-117A program marked the beginning of the stealth revolution, which has had enormous benefits for national security.
DARPA microelectronics gave rise to today's GPS devices.
Navigation in the Palm of Your Hand
Early GPS receivers were bulky, heavy devices. In 1983, DARPA set out to miniaturize them, leading to a much broader adoption of GPS capability.
First rough conceptual design of the ARPANET.
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ARPA research played a central role in launching the Information Revolution. The agency developed and furthered much of the conceptual basis for the ARPANET—prototypical communications network launched nearly half a century ago—and invented the digital protocols that gave birth to the Internet.
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