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Defense Advanced Research Projects AgencyWork With Us

DARPA Electronics Resurgence Initiative

DARPA Electronics Resurgence Initiative

Page Last Updated 4/2/20

ERI Overview and Structure

In June 2017, DARPA announced the Electronics Resurgence Initiative (ERI) as a bold response to several technical and economic trends in the microelectronics sector. Among these trends, the rapid increase in the cost and complexity of advanced microelectronics design and manufacture is challenging a half-century of progress under Moore’s Law, prompting a need for alternative approaches to traditional transistor scaling. Meanwhile, non-market foreign forces are working to shift the electronics innovation engine overseas and cost-driven foundry consolidation has limited Department of Defense (DoD) access to leading-edge electronics, challenging U.S. economic and security advantages. Moreover, highly publicized challenges to the nation’s digital backbone are fostering a new appreciation for electronics security—a longtime defense concern.

Building on the tradition of other successful government-industry partnerships, ERI aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and the DoD to address these challenges. There is significant historical precedent to suggest the viability of this approach, as each wave of modern electronics development has benefitted from the combination of defense-funded academic research and commercial sector investment. In the 1980s, when geometric silicon scaling started to make low-volume integrated circuit fabrication unaffordable, DARPA’s investment in the Metal Oxide Silicon Implementation Service (MOSIS) opened the door to rapid, low-cost chip manufacture, laying the foundation for the nation’s world-leading fabless design industry. In the 1990s, a combination of defense, academic, and commercial partners pioneered 193nm lithography, which became the industry critical fabrication process over the past two decades. A third wave of electronics innovation emerged as Dennard scaling ended in the 2000s, with the semiconductor industry adopting Fin Field Effect Transistors (FinFETs), a DARPA-funded innovation that drove low power computing and kicked off an era of 3D devices.

Given today’s cost, complexity, and security challenges, the nation now stands ready to collaboratively innovate a 4th wave of electronics progress. DARPA envisions four key areas of development—3D heterogeneous integration, new materials & devices, specialized functions, and design & security—each of which have been central to ERI since its inception. Leveraging 3D heterogeneous integration, the 4th wave should support continuing electronics progress despite challenges to traditional silicon scaling. This integration will enable innovators to both add new materials and devices to the silicon foundation and create specialized functions precisely designed to meet the diverse needs of the commercial and defense sectors. To manage the complexity of working in three dimensions, the 4th wave will also demand new architectures and design tools that address rising design costs, enable rapid system upgrades, and make security integration a primary design concern.

Working with ERI

As a community, ERI partners must ensure that the benefits from ERI’s 20+ DARPA-funded programs differentially accrue to the U.S. commercial and defense base. To achieve this goal, ERI programs incorporate the joint efforts of dozens of academic, commercial, and defense industry researchers and transition partners. While results to date from these collaborations, as highlighted at the 2018 and 2019 ERI Summits, point to several opportunities to promote U.S. microelectronics leadership, DARPA continuously seeks to launch new research efforts and to attract new partners.

This website aims to keep the community apprised of ERI programs, as highlighted under “Open Opportunities” and “Ongoing ERI Programs,” as well as opportunities to shape future research investments relevant to the 4th wave of electronics innovation, as highlighted under “Events Calendar.” DARPA is eager to work collaboratively with entities that will make foundational contributions to U.S. economic and national security interests – both as researchers and transition partners. Please check back regularly for updates. For general inquiries, including eligibility and participation, please reach out to ERI_page3@darpa.mil. Media questions and requests should be directed to outreach@darpa.mil.

Getting Started

Those who aim to begin engaging with ERI should consider the DARPA/MTO Collaboration 101 slides as presented by Office Director Mark Rosker at the 2019 DARPA ERI Summit, part of the archive of slides, videos, and posters from that event. Open opportunities and ongoing ERI programs are listed at right, with the full DARPA/MTO Opportunities List available here. Current performers on ERI Programs are listed here.

Further general DARPA guidance is available for entities of various types in the Work With Us menu at top: industry, small businesses, universities, and government and military.

 

Tags

| Algorithms | Complexity | Contracts | Cost | Decentralization | Electronics | Globalization | Integration | Manufacturing | Materials | Microchips | Microsystems | Tech-Foundations |

 

Offices

Advanced integrated circuitry.

Microsystems Technology Office

The Microsystems Technology Office’s (MTO) core mission is to develop high-performance intelligent microsystems and next-generation components to ensure U.S. dominance in the areas of Command, Control, Communications, Computing, Intelligence, Surveillance, and Reconnaissance (C4ISR), Electronic Warfare (EW), and Directed Energy (DE). The effectiveness, survivability, and lethality of these systems depend critically on the microsystems contained inside.
| Agency | Decentralization | Electronics | EW | Globalization | Microsystems | Mobile | Photonics | PNT | Spectrum |

Similarly    Tagged    Content

DARPA Announces ERI Summit 2019 Workshops
DARPA Announces Second Annual ERI Summit
Bringing Advanced Microelectronics to Revolutionary Defense Applications
DARPA Announces Next Phase of Electronics Resurgence Initiative
Electronics Resurgence Initiative Summit

OPEN OPPORTUNITIES

HR001118S0060: Microsystems Technology Office (MTO) Office-Wide

ONGOING ERI PROGRAMS

3D Heterogeneous Integration

Lasers for Universal Microscale Optical Systems (LUMOS)

Three Dimensional Monolithic System-on-Chip (3DSOC)

Compact Heterogeneous Integration and IP Reuse Strategies (CHIPS)

Millimeter Wave Digital Arrays (MIDAS)

Photonics in the Package for Extreme Scalability (PIPES)

New Materials & Devices

Foundations Required for Novel Compute (FRANC)

Technologies For Mixed-Mode Ultra Scaled Integrated Circuits (T-MUSIC)

Specialized Functions

Digital RF Battlespace Emulator (DRBE)

Domain-Specific System on Chip (DSSoC)

Hierarchical Identify Verify Exploit (HIVE)

Lifelong Learning Machines (L2M)

Near Zero Power RF and Sensor Operations (N-ZERO)

Real Time Machine Learning (RTML)

Software Defined Hardware (SDH)

Design & Security

Automatic Implementation of Secure Silicon (AISS)

Circuit Realization At Faster Timescales (CRAFT)

Guaranteed Architectures for Physical Security (GAPS)

Intelligent Design of Electronic Assets (IDEA)

Posh Open Source Hardware (POSH)

Performant Automation of Parallel Program Assembly (PAPPA, μE)

Safeguards against Hidden Effects and Anomalous Trojans in Hardware (SHEATH, μE )

System Security Integrated Through Hardware and Firmware (SSITH)

Cross-Cutting

Electronics Resurgence Initiative: Defense Applications (ERI:DA)

Joint University Microelectronics Program (JUMP)

RESOURCES

Events Calendar

2020 DARPA ERI Summit & MTO Symposium (8/18/20 – 8/20/20)

Past Events

ERI In the News

Researchers Selected to Pursue Photonic Signaling for Microelectronics System Scalability (3/16/2020)

T-MUSIC Selects Performers to Develop Integrated Mixed-Mode RF Electronics in Onshore Foundries (2/4/2020)

Powering Future Optical Microsystems with Chip-Scale Integrated Photonics (LUMOS) (11/21/19)

Additional Information

Gordon Moore’s seminal 1965 paper

ERI Performer List

 

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Selected DARPA Achievements

DARPA collaborated with industry on stealth technology.
DARPA’s Stealth Revolution
In the early days of DARPA’s work on stealth technology, Have Blue, a prototype of what would become the F-117A, first flew successfully in 1977. The success of the F-117A program marked the beginning of the stealth revolution, which has had enormous benefits for national security.
DARPA microelectronics gave rise to today's GPS devices.
Navigation in the Palm of Your Hand
Early GPS receivers were bulky, heavy devices. In 1983, DARPA set out to miniaturize them, leading to a much broader adoption of GPS capability.
First rough conceptual design of the ARPANET.
Paving the Way to the Modern Internet
ARPA research played a central role in launching the Information Revolution. The agency developed and furthered much of the conceptual basis for the ARPANET—prototypical communications network launched nearly half a century ago—and invented the digital protocols that gave birth to the Internet.
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