Defense Advanced Research Projects AgencyTagged Content List

Design Methods

Mathematical and computational methods for physical and mechanical system design

Showing 3 results for Design + Programs RSS
The Automatic Implementation of Secure Silicon (AISS) program aims to ease the burden of developing secure chips. AISS seeks to create a novel, automated chip design flow that will allow security mechanisms to scale consistently with the goals of a chip design. The target design flow will provide a means of rapidly evaluating architectural alternatives that best address the required design and security metrics, as well as varying cost models to optimize the economics versus security trade-off. The target system on chip (SoC) – will be automatically generated, integrated, and optimized, and will consist of two partitions – an application specific processor partition and a security partition implementing the on-chip security features. By bringing greater automation to the chip design process, the burden of security inclusion can be profoundly decreased.
The DARPA Nitride Electronics NeXt-Generation Technology (NEXT) program had the goal of developing a revolutionary GaN transistor technology to simultaneously achieve high-speed and large voltage swing. The expected outcome of the program was that highly-scaled GaN devices would ultimately benefit the design of efficient millimeter wave power amplifiers and mixed-signal circuits. The NEXT program was successful in developing GaN transistors with deeply scaled gate lengths along with modifications to the heteroepitaxial channel material, ohmic contacts, and overall gate structure, resulting in record performance for GaN devices.
New manufacturing technologies such as additive manufacturing have vastly improved the ability to create shapes and material properties previously thought impossible. Generating new designs that fully exploit these properties, however, has proven extremely challenging. Conventional design technologies, representations, and algorithms are inherently constrained by outdated presumptions about material properties and manufacturing methods. As a result, today’s design technologies are simply not able to bring to fruition the enormous level of physical detail and complexity made possible with cutting-edge manufacturing capabilities and materials.