Defense Advanced Research Projects AgencyTagged Content List

Opportunities for Funding and/or Engagement

Relating to potential relationships with DARPA

Showing 8 results for Opportunities + Integration RSS
Military commanders responsible for situational awareness and command and control of assets in space know all too well the challenge that comes from the vast size of the space domain. The volume of Earth’s operational space domain is hundreds of thousands times larger than the Earth’s oceans. It contains thousands of objects hurtling at tens of thousands of miles per hour. The scales and speeds in this extreme environment are difficult enough to grasp conceptually, let alone operationally, as is required for commanders overseeing the nation’s increasingly critical space assets.
Today’s critical Department of Defense (DOD) systems and platforms rely on advanced electronics to address national security objectives. To help tackle obstacles facing a half-century of electronics advancement, DARPA launched the Electronics Resurgence Initiative (ERI) – a five-year, upwards of $1.5 billion investment in the future of domestic electronic systems. In November, DARPA expanded ERI with the announcement of ERI Phase II, which seeks to further enmesh the technology needs and capabilities of the defense enterprise with the commercial and manufacturing realities of the electronics industry.
January 30, 2018,
DARPA Conference Center
DARPA’s Tactical Technology Office is hosting a Proposers Day meeting to provide information to potential applicants on the objectives of Its new Broad Agency Announcement, Hallmark Tools and Capabilities 2 (Hallmark-TC2), part of the existing Hallmark program. Hallmark-TC2 aims to develop and validate additional technologies to complement and augment the original Hallmark tools and capabilities currently being integrated into Hallmark software testbeds.
November 1, 2018, 8:30 AM ET,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day to provide information to potential proposers on the objectives of the new program. PIPES will develop optical I/O for emerging data movement needs of commercial and military systems. PIPES seeks to emplace integrated optical transceiver capabilities into cutting-edge multi-chip modules (e.g., field-programmable gate arrays (FPGAs), graphical processing units (GPUs), central processing units (CPUs), and application-specific integrated circuits (ASICs)) for 2023-era microelectronics with performance well beyond currently available solutions. In parallel, PIPES aims to develop novel optical I/O approaches and advanced optical packaging and switching technologies to satisfy data movement demands of highly parallel systems in the 2028 timeframe. Additionally, the program will combine the advanced microelectronics capabilities of commercial industry, innovative photonics solutions from research communities, and DoD-specific application drivers from the defense industry into a framework for long-term technology availability by establishing and supporting a domestic technology ecosystem.
August 12, 2019, 8:30 AM ET,
DARPA Conference Center
The Information Innovation Office is holding a Proposers Day meeting to provide information to potential proposers on the objectives of the new Symbiotic Design for Cyber Physical Systems program and to facilitate teaming. The goal of the program is to develop AI-based approaches to enable correct-by-construction design of military-relevant, cyber-physical systems (CPS), in order to reduce the time from their inception to deployment from years to months, and enhance innovation in design. These approaches would complement and augment existing model-based design technologies, and enable humans and computers to collaborate on correct-by-construction design of CPS.