Defense Advanced Research Projects AgencyTagged Content List

Opportunities for Funding and/or Engagement

Relating to potential relationships with DARPA

Showing 6 results for Opportunities + Electronics RSS
DARPA published its Young Faculty Award (YFA) 2018 Research Announcement today, seeking proposals in 26 different topic areas—the largest number of YFA research areas ever solicited.
Today’s critical Department of Defense (DOD) systems and platforms rely on advanced electronics to address national security objectives. To help tackle obstacles facing a half-century of electronics advancement, DARPA launched the Electronics Resurgence Initiative (ERI) – a five-year, upwards of $1.5 billion investment in the future of domestic electronic systems. In November, DARPA expanded ERI with the announcement of ERI Phase II, which seeks to further enmesh the technology needs and capabilities of the defense enterprise with the commercial and manufacturing realities of the electronics industry.
April 10, 2019, 9:00 AM EDT,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting to provide information on our new Automatic Implementation of Secure Silicon (AISS) program. AISS will address the economic and technical challenges associated with building in chip security. The program aims to automate the process of incorporating scalable defense mechanisms into chip designs, while allowing designers to explore economics versus security trade-offs, and maximize design productivity. The objective is to develop a design tool and IP ecosystem – which includes tool vendors, chip developers, IP licensers, and the open-source community – that will allow security to be inexpensively incorporated into chip designs with minimal effort and expertise, ultimately making scalable on-chip security pervasive.
January 23, 2019,
DARPA Conference Center
The Information Innovation Office is holding a Proposers Day meeting to provide information to potential proposers on the objectives of the new Guaranteed Architecture for Physical Security (GAPS) program. GAPS will develop hardware and software architectures that can provide physically provable guarantees around high-risk transactions, or where data moves between systems of different security levels. DARPA wants to ensure that these transactions are isolated and that the systems they move across are enabled with the necessary data security assertions. The intended outputs of this program are hardware and software co-design tools that allow data separation requirements to be defined during design, and protections that can be physically enforced at system runtime.
November 20, 2019, 8:00 AM EST,
Executive Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting covering the new Lasers for Universal Microscale Optical Systems (LUMOS) program. The goal of LUMOS is to transform optical microsystems through the co-integration of direct-emission materials, such as InP, GaN, and GaAs, with low-loss dielectric materials such as silicon and silicon nitride to create accessible, manufacturable systems. LUMOS also seeks to leverage new concepts in nanophotonic structures, non-reciprocity, and nonlinear processes, as well as alternative materials that possess strong electro-optic and novel properties, such as thin-film lithium niobate, III-nitrides, and other advanced compounds that enable new component functionality. Finally, LUMOS seeks to illustrate the benefits of complete component integration by pursuing DoD-relevant system demonstrations with compelling gains in performance and significant size, weight, and power (SWaP) advantages over current state-of-the-art solutions.