Defense Advanced Research Projects AgencyTagged Content List

Thermal Management

Materials, designs and systems to manage and disperse heat and improve technology effectiveness

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The increased density of electronic components and subsystems in military electronic systems exacerbates the thermal management challenges facing engineers. The military platforms that host these systems often cannot physically accommodate the large cooling systems needed for thermal management, meaning that heat can be a limiting factor for performance of electronics and embedded computers.
The increased density of components in today’s electronics has pushed heat generation and power dissipation to unprecedented levels. Current thermal management solutions, usually involving remote cooling, where heat must be conducted away from components before rejection to the air, are unable to limit the temperature rise of today’s complex electronic components without adding considerable weight and volume to electronic systems. The result is complex military systems that continue to grow in size and weight due to the inefficiencies of existing thermal management hardware.