Defense Advanced Research Projects AgencyTagged Content List

Foundational Strategic Technologies and Systems

Versatile enabling technologies that could lead to entire new classes of capabilities

Showing 3 results for Tech-Foundations + SWAP RSS
07/19/2016
Open the hood of just about any electronic gadget and you probably will find one or more printed circuit boards (PCBs)—most often in a leaf green color—studded with processing, memory, data-relaying, graphics, and other types of chips and components, all interconnected with a labyrinth of finely embossed wiring. By challenging the technology community to integrate the collective functions hosted by an entire PCB onto a device the size of a single chip, DARPA’s newest program is making a bid to usher in a fresh dimension of technology miniaturization.
09/11/2017
Here’s your task. Build a tiny sensor that detects a signature of infrared (IR) wavelengths characteristic of a hot tailpipe, a wood fire, or perhaps even a human being. Design the sensor so that it can remain dormant and unattended but always alert, even for years, without drawing on battery power. And build the sensor so that the act of detection itself can initiate the emission of a signal that alerts warfighters, firefighters, or others that a “signal-of-interest” has been detected. It’s just the sort of intelligence, reconnaissance, and surveillance (ISR) technology that can increase situational awareness while minimizing the need for potentially dangerous maintenance missions to replace run-down batteries.
September 21, 2016,
Westin Tysons Corner
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is sponsoring a Proposers Day to provide information to potential proposers on the objectives of an anticipated Broad Agency Announcement (BAA) for the Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. The Proposers Day will be held on September 21, 2016, from 8:00 AM to 5:00 PM EDT at the Westin Tysons Corner in Falls Church, VA.