Defense Advanced Research Projects AgencyTagged Content List

Foundational Strategic Technologies and Systems

Versatile enabling technologies that could lead to entire new classes of capabilities

Showing 6 results for Tech-Foundations + Manufacturing RSS
09/13/2017
With the official roll out of the Electronics Resurgence Initiative’s latest investments today, DARPA hopes to open new innovation pathways to address impending engineering and economics challenges that, if left unanswered, could challenge what has been a relentless half-century run of progress in microelectronics technology. To maintain healthy forward momentum, the ERI over the next four years will commit hundreds of millions of dollars to nurture research in advanced new materials, circuit design tools, and system architectures. In addition to a half-dozen or so existing DARPA programs, and the largest program in the U.S. that funds basic electronics research at universities, 
06/26/2018
First announced in June 2017, DARPA’s Electronics Resurgence Initiative (ERI) is a multi-year, upwards of $1.5 billion investment in jumpstarting innovation and collaboration across the U.S. electronics community to address an array of long foreseen challenges to Moore’s Law. To kickoff this community-wide effort, DARPA is hosting its first annual ERI Summit from July 23-25 in San Francisco, CA. The three-day event will bring together leading voices from across the electronics community–including Alphabet, Applied Materials, Intel, Synopsys, Cadence, Mentor Graphics, NVIDIA, and IBM–to address challenges and opportunities for the next half century of electronics progress.
July 23-25, 2018,
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DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
Military platforms and structures, such as vehicles, ships, aircraft and buildings, must withstand transient shock, vibrations and other structural loads in a variety of demanding operational environments. These frequent and varying transient loads are often transmitted to occupants, which can degrade warfighters’ performance by creating discomfort and injuries. In addition, varying loads can lead to shortened service life for the military platforms, as well as the equipment inside. Currently, structures designed to achieve high stiffness for static loads (dead weight) typically can’t adapt to or dampen dynamic loads well. Conversely, structures designed for high damping do not carry conventional loads as efficiently.
Program Manager
Dr. John Main has spent his career developing new technologies and businesses. He is currently a Program Manager in the Defense Sciences Office at DARPA where he is responsible for initiating new DARPA programs in the physical sciences and fostering the R&D communities that will support those programs. This is Dr. Main’s second tour as a DARPA Program Manager. His first tour at DARPA began in 2002 and resulted in programs in a broad range of technical areas including biologically inspired materials, fast and efficient human-powered swimming, rapid rooftop access, small-scale power generation, GPS-denied underwater navigation, and human exoskeletons for increased warfighter endurance.