Defense Advanced Research Projects AgencyTagged Content List

Size, Weight and Power Constraints

Making technologies smaller, lighter and more power-efficient to increase military effectiveness

Showing 16 results for SWAP + Electronics RSS
Next-generation military microsystems in areas such as radar, guidance and high-data-rate communications will require advances in integrated circuit (IC) technology. The technical goal of the Efficient Linearized All-Silicon Transmitter ICs (ELASTx) program, now in its final states, has been to develop monolithic, high power-added-efficiency (PAE), high-linearity, millimeter-wave, silicon-based transmitter ICs.
The millimeter wave (MMW) and sub-MMW part of the spectrum is of interest to DoD. Several relevant DoD and commercial applications including high-bandwidth communications, collision-avoidance radar, security screening, and high resolution imaging; and this region of the spectrum remains largely unexploited due to the challenges in accessing upper MMW and sub-MMW frequencies.
The effectiveness of combat operations across all domains increasingly depends on our ability to control and exploit the electromagnetic (EM) spectrum and to deny its use to our adversaries. Below 30 GHz, the proliferation of inexpensive high-power commercial radio frequency (RF) sources has made the EM spectrum crowded and contested, challenging our spectrum dominance. The numerous tactical advantages offered by operating at higher frequencies, most notably the wide bandwidths available, is driving both commercial and DoD solid-state and vacuum electronic amplifiers into the millimeter wave (mm-wave) spectrum above 30 GHz.
The Magnetic Miniaturized and Monolithically Integrated Components (M3IC) program aims to integrate magnetic components onto semiconductor materials, improving the size and functionality of electromagnetic (EM) systems for communications, radar, and electronic warfare (EW). Current EM systems use magnetic components such as circulators, inductors, and isolators, but these are bulky and cannot be integrated with miniaturized electronic circuitry.
Transductional materials convert energy between different forms or domains, such as thermal to electrical energy, or electric field to magnetic field.