Defense Advanced Research Projects AgencyTagged Content List

Size, Weight and Power Constraints

Making technologies smaller, lighter and more power-efficient to increase military effectiveness

Showing 16 results for SWAP + Electronics RSS
Many essential military capabilities—including autonomous navigation, chemical-biological sensing, precision targeting and communications—increasingly rely upon laser-scanning technologies such as LIDAR (think radar that uses light instead of radio waves). These technologies provide amazing high-resolution information at long ranges but have a common Achilles heel: They require mechanical assemblies to sweep the laser back and forth. These large, slow opto-mechanical systems are both temperature- and impact-sensitive and often cost tens of thousands of dollars each—all factors that limit widespread adoption of current technologies for military and commercial use.
A newly-announced DARPA program is betting that unprecedented on-chip integration of workhorse electronic components, such as transistors and capacitors, with less-familiar magnetic components with names like circulators and isolators, will open an expansive pathway to more capable electromagnetic systems. The Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC), program will orchestrate research into miniaturized magnetic components with a goal of catalyzing chip-based innovations in radar and other radio frequency (RF) systems—and satisfying growing military and civilian demands for new ways to maneuver within the increasingly crowded electromagnetic spectrum.
Open the hood of just about any electronic gadget and you probably will find one or more printed circuit boards (PCBs)—most often in a leaf green color—studded with processing, memory, data-relaying, graphics, and other types of chips and components, all interconnected with a labyrinth of finely embossed wiring. By challenging the technology community to integrate the collective functions hosted by an entire PCB onto a device the size of a single chip, DARPA’s newest program is making a bid to usher in a fresh dimension of technology miniaturization.
September 21, 2016,
Westin Tysons Corner
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is sponsoring a Proposers Day to provide information to potential proposers on the objectives of an anticipated Broad Agency Announcement (BAA) for the Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. The Proposers Day will be held on September 21, 2016, from 8:00 AM to 5:00 PM EDT at the Westin Tysons Corner in Falls Church, VA.
The explosive growth in mobile and telecommunication markets has pushed the semiconductor industry toward integration of digital, analog, and mixed-signal blocks into system-on-chip (SoC) solutions. Advanced silicon (Si) complementary metal oxide semiconductor (CMOS) technology has enabled this integration, but has also led to a rise in costs associated with design and processing.