Defense Advanced Research Projects AgencyTagged Content List

Size, Weight and Power Constraints

Making technologies smaller, lighter and more power-efficient to increase military effectiveness

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The low cost of digital imaging devices has allowed them to become ubiquitous consumer products. This low cost is made possible by leveraging a mature complementary metal oxide semiconductor (CMOS) processing infrastructure and the ability to fabricate complete focal plane arrays (FPAs) at the wafer scale. A similar trend is occurring at a smaller scale with thermal imaging technologies. Microbolometers that are sensitive in the LWIR spectrum are also manufactured at the wafer scale and the resulting cost reduction is enabling thermal imagers at consumer-grade price points.