Defense Advanced Research Projects AgencyTagged Content List

Information or Signal Processing

Computational tools and techiques for manipulating, analyzing, and synthesizing signals and data

Showing 11 results for Processing + Microsystems RSS
01/17/2013
The inherent goodness of miniaturizing electronics has been key to a wide array of technology innovations and an important economic driver for several decades. For example, the seemingly endless shrinking of the transistor has allowed the semiconductor industry to place ever more devices on the same amount of silicon. Each time the size shrunk, transistors became faster and used less power, allowing increasingly capable electronics in smaller packages that cost less. In recent years, power requirements, excessive heat and other problems associated with physical limitations have reduced the advantages of continuing to shrink size.
09/10/2014
DARPA’s Electronic-Photonic Heterogeneous Integration (E-PHI) program has successfully integrated billions of light-emitting dots on silicon to create an efficient silicon-based laser. The breakthrough, achieved by researchers working on the program at the University of California, Santa Barbara (UCSB), will enable the production of inexpensive and robust microsystems that exceed the performance capabilities of current technologies.
09/07/2017
DARPA published its Young Faculty Award (YFA) 2018 Research Announcement today, seeking proposals in 26 different topic areas—the largest number of YFA research areas ever solicited.
August 11, 2016,
George Mason University – Arlington, VA Campus (Founders Hall)
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is hosting a Proposers Day in support of the Hierarchical Identify Verify Exploit (HIVE) Program on August 11, 2016, at George Mason University – Arlington, VA Campus (Founders Hall), located at 3351 North Fairfax Drive, Arlington, VA, 22201, from 9:00 AM to 12:30 PM, Eastern Daylight Time (EDT).
Radio Frequency and mixed signal electronics face performance limitations due to the limited circuit complexity possible in typical high-speed/high-dynamic-range compound semiconductor integrated circuit technologies. By integrating these high-performance electronics with deep submicron silicon complementary metal-oxide semiconductor (Si CMOS) technology, designers can exploit the ultra large scale integration density of Si CMOS to combine complex signal processing and self-correction architectures with the highest performance compound semiconductor electronics, thus achieving unprecedented levels of performance (e.g. bandwidth, dynamic range, power consumption).