Defense Advanced Research Projects AgencyTagged Content List

Photonics, Optics and Lasers

Science and technology dealing with the transmission and manipulation of light

Showing 80 results for Photonics RSS
Atom-based devices have proven to be the most accurate means of measuring the physical world. Two areas of great promise are the ability to measure frequency with optically probed trapped atom clocks as well as optically cooled atom interferometer inertial sensors. Together, they could form the basis of a fully autonomous navigation and timing system, free from GPS. Integration of these laboratory based quantum devices into a practical size, weight, and power has proven challenging. Furthermore, replicating these devices at laboratory scale is still resource intensive.
Radio Frequency and mixed signal electronics face performance limitations due to the limited circuit complexity possible in typical high-speed/high-dynamic-range compound semiconductor integrated circuit technologies. By integrating these high-performance electronics with deep submicron silicon complementary metal-oxide semiconductor (Si CMOS) technology, designers can exploit the ultra large scale integration density of Si CMOS to combine complex signal processing and self-correction architectures with the highest performance compound semiconductor electronics, thus achieving unprecedented levels of performance (e.g. bandwidth, dynamic range, power consumption).
High performance optoelectronic systems, e.g. ultra low-noise lasers and optoelectronic signal sources, are employed in numerous applications such as fiber optic communications, high-precision timing references, LADAR, imaging arrays, etc. Current state-of-the-art ultra-low noise lasers and optoelectronic signal sources use macro-scale photonics for mechanical and thermal noise suppression, and off-chip electronics for feedback control. The benchtop or rack mount component-level assembly of these sources limits photonic coupling efficiency as well as the speed of electronic feedback, and also adds size and weight to the system. Integration of these components in a chip-scale form factor could greatly mitigate these limitations.
The DAHI Foundry Technology program thrust seeks to establish an accessible, manufacturable technology for device-level heterogeneous integration of a wide array of materials and devices (including, for example, multiple electronics and MEMS technologies) with complex silicon-enabled (e.g. CMOS) architectures on a common silicon substrate. of The DAHI Foundry Technology thrust will incorporate and build upon the heterogeneous integration technologies of the COSMOS and E-PHI program thrusts, while also developing new capabilities in heterogeneous integration processes, yield and circuit design innovation. 
The Direct On-Chip Digital Optical Synthesizer (DODOS) program seeks to create a technological revolution in optical frequency control analogous to the disruptive advances in microwave frequency control in the 1940s. That early development ushered in a new era for microwave technology, transformed modern warfare, and has since been enabling a multitude of Department of Defense (DoD) and civilian capabilities, including radar, navigation technologies, and satellite and terrestrial communications. Extending frequency control to the optical regime is anticipated to greatly extend the technology base for the next generation of warfighter and other capabilities.