Defense Advanced Research Projects AgencyTagged Content List

Information Microsystems

Relating to computer and other digital electronic systems

Showing 15 results for Microsystems + SWAP RSS
September 21, 2016,
Westin Tysons Corner
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is sponsoring a Proposers Day to provide information to potential proposers on the objectives of an anticipated Broad Agency Announcement (BAA) for the Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. The Proposers Day will be held on September 21, 2016, from 8:00 AM to 5:00 PM EDT at the Westin Tysons Corner in Falls Church, VA.
February 1, 2016,
DARPA Conference Center
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is hosting a Proposers Day in support of an anticipated Broad Agency Announcement (BAA) for the Atomic Clock with Enhanced Stability (ACES) program. The Proposers Day will be held on Monday, February 1, 2016, from 9:30 AM to 5:00 PM (EST) at the DARPA Conference Center, located at 675 N. Randolph Street, Arlington, Virginia 22203. The registration deadline is 5:00 PM EST on January 25, 2016. The purpose of this meeting is to provide information and promote additional discussion on the ACES program, address questions from potential proposers, and provide an opportunity for potential proposers to share their capabilities and ideas for teaming arrangements. The ACES Proposers Day will include overview presentations by government personnel, technical presentations by potential proposers and collaborators, and an open poster session to facilitate interaction and teaming. For more information, visit FedBizOpps.gov
December 17, 2015,
DARPA Conference Center
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is hosting a Proposers Day to provide information to potential proposers on the objectives that will be specified in an anticipated Broad Agency Announcement (BAA) of the Modular Optical Apertures Building Blocks (MOABB) program. The MOAB program aims to develop advanced technologies that could catalyze the creation of ultracompact light detection and ranging (LIDAR) systems.
The explosive growth in mobile and telecommunication markets has pushed the semiconductor industry toward integration of digital, analog, and mixed-signal blocks into system-on-chip (SoC) solutions. Advanced silicon (Si) complementary metal oxide semiconductor (CMOS) technology has enabled this integration, but has also led to a rise in costs associated with design and processing. Driven by aggressive digital CMOS scaling for high-volume products, Intellectual Property (IP) reuse has emerged as a tool to help lower design costs associated with advanced SoCs.
Computational capability is an enabler for nearly every military system, but increases in this capability are limited by available system power and constraints on the ability to dissipate heat. This is a challenge for embedded applications such as soldier-borne applications, UAVs and command and control systems on submarines. Today’s intelligence, surveillance and reconnaissance (ISR) systems have sensors that collect far more information than they can process in real time; as a result, what could be invaluable real-time intelligence data in the hands of our warfighters is simply discarded, or perhaps recorded and processed hours or days after it was collected.