Defense Advanced Research Projects AgencyTagged Content List

Information Microsystems

Relating to computer and other digital electronic systems

Showing 79 results for Microsystems RSS
The sophisticated electronics used by warfighters in everything from radios, remote sensors and even phones can now be made at such a low cost that they are pervasive throughout the battlefield. These electronics have become necessary for operations, but it is almost impossible to track and recover every device. At the end of operations, these electronics are often found scattered across the battlefield and might be captured by the enemy and repurposed or studied to compromise DoD’s strategic technological advantage.
The increased density of electronic components and subsystems in military electronic systems exacerbates the thermal management challenges facing engineers. The military platforms that host these systems often cannot physically accommodate the large cooling systems needed for thermal management, meaning that heat can be a limiting factor for performance of electronics and embedded computers.
Many military radio frequency (RF) systems, like radar and communication systems, use a class of power amplifiers (PAs) called monolithic microwave integrated circuits (MIMIC). MMIC PAs using gallium nitride (GaN) transistors hold great promise for enhanced RF performance, but operational characteristics are strongly affected by thermal resistance. Much of this resistance comes at the thermal junction where the substrate material of the circuit connects to the GaN transistor. If the junction and substrate have poor thermal properties, temperature will rise and performance will decrease.
Constantly losing energy is something we deal with in everything we do. If you stop pedaling a bike, it gradually slows; if you let off the gas, your car also slows. As these vehicles move, they also generate heat from friction. Electronics encounter a similar effect as groups of electrons carry information from one point to another. As electrons move, they dissipate heat, reducing the distance a signal can travel. DARPA-sponsored researchers under the Mesodynamic Architectures (Meso) program, however, may have found a potential way around this fundamental problem.
Used and non-authentic counterfeit electronic components are widespread throughout the defense supply chain; over the past two years alone, more than one million suspect parts have been associated with known supply chain compromises.