Defense Advanced Research Projects AgencyTagged Content List

Information Microsystems

Relating to computer and other digital electronic systems

Showing 87 results for Microsystems RSS
High performance optoelectronic systems, e.g. ultra low-noise lasers and optoelectronic signal sources, are employed in numerous applications such as fiber optic communications, high-precision timing references, LADAR, imaging arrays, etc. Current state-of-the-art ultra-low noise lasers and optoelectronic signal sources use macro-scale photonics for mechanical and thermal noise suppression, and off-chip electronics for feedback control. The benchtop or rack mount component-level assembly of these sources limits photonic coupling efficiency as well as the speed of electronic feedback, and also adds size and weight to the system. Integration of these components in a chip-scale form factor could greatly mitigate these limitations.
The DAHI Foundry Technology program thrust seeks to establish an accessible, manufacturable technology for device-level heterogeneous integration of a wide array of materials and devices (including, for example, multiple electronics and MEMS technologies) with complex silicon-enabled (e.g. CMOS) architectures on a common silicon substrate. of The DAHI Foundry Technology thrust will incorporate and build upon the heterogeneous integration technologies of the COSMOS and E-PHI program thrusts, while also developing new capabilities in heterogeneous integration processes, yield and circuit design innovation. 
The general-purpose computer has remained the dominant computing architecture for the last 50 years, driven largely by the relentless pace of Moore’s Law. As this trajectory shows signs of slowing, however, it has become increasingly more challenging to achieve performance gains from generalized hardware, setting the stage for a resurgence in specialized architectures. Today’s specialized, application-specific integrated circuits (ASICs) — hardware customized for a specific application — offer limited flexibility and are costly to design, fabricate, and program.
Modern networks and platforms rely on access to the radio frequency (RF) spectrum for communications, radar sensing, command and control, time transfer, and geo-location. Electromagnetic interference, due to congestion in the spectrum or malicious jamming, can have catastrophic effects. Countering such interference is particularly important for unmanned platforms. To address this challenge, the Hyper-wideband Enabled RF Messaging (HERMES) program seeks to provide an assured link for essential communications by developing a jammer- countering capability that is orders of magnitude beyond the state-of-the-art.
Next-generation intelligent systems supporting Department of Defense (DoD) applications like artificial intelligence, autonomous vehicles, shared spectrum communication, electronic warfare, and radar require processing efficiency that is orders of magnitude beyond what is available through current commercial electronics. Reaching the performance levels required by these DoD applications however will require developing highly complex system-on-chip (SoC) platforms that leverage the most advanced integrated circuit technologies.