Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 6 results for Microchips + Events RSS
April 10, 2019, 9:00 AM EDT,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting to provide information on our new Automatic Implementation of Secure Silicon (AISS) program. AISS will address the economic and technical challenges associated with building in chip security. The program aims to automate the process of incorporating scalable defense mechanisms into chip designs, while allowing designers to explore economics versus security trade-offs, and maximize design productivity. The objective is to develop a design tool and IP ecosystem – which includes tool vendors, chip developers, IP licensers, and the open-source community – that will allow security to be inexpensively incorporated into chip designs with minimal effort and expertise, ultimately making scalable on-chip security pervasive.
March 29, 2017,
DARPA Conference Center
DARPA will host a Proposers Day in support of the DREaM program on March 29, 2017 at the Hilton in Arlington, VA, from 9:00 AM to 1:00 PM. Participants must register for the DREaM Proposers Day through the registration website by March 27, 2017 at 5:00 PM Eastern Time. More information about the Proposers Day is available in a Special Notice (DARPA-SN-17-24) posted on fbo.gov (ADD URL). The DREaM program’s Broad Agency Announcement (HR001117S0024), which will more fully detail the technical goals and performer requirements, is expected to be released and posted on fbo.gov prior to the Proposers Day.
July 23-25, 2018,
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DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
July 15 – 17, 2019,
Detroit, MI
To jump-start innovation and foster forward-looking collaborations across the U.S. electronics community, DARPA’s Microsystems Technology Office will host a three-day event that will bring together those most impacted by the coming inflection in Moore’s Law. The 2019 ERI Summit will highlight the technical achievements of ERI programs, support continued research collaborations, and offer opportunities to solicit community input on new efforts.
November 1, 2018, 8:30 AM ET,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day to provide information to potential proposers on the objectives of the new program. PIPES will develop optical I/O for emerging data movement needs of commercial and military systems. PIPES seeks to emplace integrated optical transceiver capabilities into cutting-edge multi-chip modules (e.g., field-programmable gate arrays (FPGAs), graphical processing units (GPUs), central processing units (CPUs), and application-specific integrated circuits (ASICs)) for 2023-era microelectronics with performance well beyond currently available solutions. In parallel, PIPES aims to develop novel optical I/O approaches and advanced optical packaging and switching technologies to satisfy data movement demands of highly parallel systems in the 2028 timeframe. Additionally, the program will combine the advanced microelectronics capabilities of commercial industry, innovative photonics solutions from research communities, and DoD-specific application drivers from the defense industry into a framework for long-term technology availability by establishing and supporting a domestic technology ecosystem.