Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 6 results for Microchips + Opportunities RSS
09/07/2017
DARPA published its Young Faculty Award (YFA) 2018 Research Announcement today, seeking proposals in 26 different topic areas—the largest number of YFA research areas ever solicited.
12/10/2018
Today’s critical Department of Defense (DOD) systems and platforms rely on advanced electronics to address national security objectives. To help tackle obstacles facing a half-century of electronics advancement, DARPA launched the Electronics Resurgence Initiative (ERI) – a five-year, upwards of $1.5 billion investment in the future of domestic electronic systems. In November, DARPA expanded ERI with the announcement of ERI Phase II, which seeks to further enmesh the technology needs and capabilities of the defense enterprise with the commercial and manufacturing realities of the electronics industry.
April 10, 2019, 9:00 AM EDT,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting to provide information on our new Automatic Implementation of Secure Silicon (AISS) program. AISS will address the economic and technical challenges associated with building in chip security. The program aims to automate the process of incorporating scalable defense mechanisms into chip designs, while allowing designers to explore economics versus security trade-offs, and maximize design productivity. The objective is to develop a design tool and IP ecosystem – which includes tool vendors, chip developers, IP licensers, and the open-source community – that will allow security to be inexpensively incorporated into chip designs with minimal effort and expertise, ultimately making scalable on-chip security pervasive.
November 20, 2019, 8:00 AM EST,
Executive Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting covering the new Lasers for Universal Microscale Optical Systems (LUMOS) program. The goal of LUMOS is to transform optical microsystems through the co-integration of direct-emission materials, such as InP, GaN, and GaAs, with low-loss dielectric materials such as silicon and silicon nitride to create accessible, manufacturable systems. LUMOS also seeks to leverage new concepts in nanophotonic structures, non-reciprocity, and nonlinear processes, as well as alternative materials that possess strong electro-optic and novel properties, such as thin-film lithium niobate, III-nitrides, and other advanced compounds that enable new component functionality. Finally, LUMOS seeks to illustrate the benefits of complete component integration by pursuing DoD-relevant system demonstrations with compelling gains in performance and significant size, weight, and power (SWaP) advantages over current state-of-the-art solutions.
November 1, 2018, 8:30 AM ET,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day to provide information to potential proposers on the objectives of the new program. PIPES will develop optical I/O for emerging data movement needs of commercial and military systems. PIPES seeks to emplace integrated optical transceiver capabilities into cutting-edge multi-chip modules (e.g., field-programmable gate arrays (FPGAs), graphical processing units (GPUs), central processing units (CPUs), and application-specific integrated circuits (ASICs)) for 2023-era microelectronics with performance well beyond currently available solutions. In parallel, PIPES aims to develop novel optical I/O approaches and advanced optical packaging and switching technologies to satisfy data movement demands of highly parallel systems in the 2028 timeframe. Additionally, the program will combine the advanced microelectronics capabilities of commercial industry, innovative photonics solutions from research communities, and DoD-specific application drivers from the defense industry into a framework for long-term technology availability by establishing and supporting a domestic technology ecosystem.