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July 15 – 17, 2019,
To jump-start innovation and foster forward-looking collaborations across the U.S. electronics community, DARPA’s Microsystems Technology Office will host a three-day event that will bring together those most impacted by the coming inflection in Moore’s Law. The 2019 ERI Summit will highlight the technical achievements of ERI programs, support continued research collaborations, and offer opportunities to solicit community input on new efforts.
This Request for Information (RFI) from the Defense Advanced Research Projects Agency’s (DARPA) Microsystems Technology Office (MTO) seeks information on applications for revolutionary microsystems or integrated circuits which will be realized by 3D monolithic system-on-a-chip (3DSoC) technology.