Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 4 results for Microchips + SWAP RSS
Long coils of optical waveguides—any structure that can guide light, like conventional optical fiber—can be used to create a time delay in the transmission of light. Such photonic delays are useful in military application ranging from small navigation sensors to wideband phased array radar and communication antennas. Although optical fiber has extremely low signal loss, an advantage that enables the backbone of the global Internet, it is limited in certain photonic delay applications. Connecting fiber optics with microchip-scale photonic systems requires sensitive, labor-intensive assembly and a system with a large number of connections suffers from signal loss.
Many essential military capabilities—including autonomous navigation, chemical-biological sensing, precision targeting and communications—increasingly rely upon laser-scanning technologies such as LIDAR (think radar that uses light instead of radio waves). These technologies provide amazing high-resolution information at long ranges but have a common Achilles heel: They require mechanical assemblies to sweep the laser back and forth. These large, slow opto-mechanical systems are both temperature- and impact-sensitive and often cost tens of thousands of dollars each—all factors that limit widespread adoption of current technologies for military and commercial use.
A newly-announced DARPA program is betting that unprecedented on-chip integration of workhorse electronic components, such as transistors and capacitors, with less-familiar magnetic components with names like circulators and isolators, will open an expansive pathway to more capable electromagnetic systems. The Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC), program will orchestrate research into miniaturized magnetic components with a goal of catalyzing chip-based innovations in radar and other radio frequency (RF) systems—and satisfying growing military and civilian demands for new ways to maneuver within the increasingly crowded electromagnetic spectrum.
The explosive growth in mobile and telecommunication markets has pushed the semiconductor industry toward integration of digital, analog, and mixed-signal blocks into system-on-chip (SoC) solutions. Advanced silicon (Si) complementary metal oxide semiconductor (CMOS) technology has enabled this integration, but has also led to a rise in costs associated with design and processing.