Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 9 results for Microchips + Spectrum RSS
09/07/2017
DARPA published its Young Faculty Award (YFA) 2018 Research Announcement today, seeking proposals in 26 different topic areas—the largest number of YFA research areas ever solicited.
02/04/2020
Today’s defense electronics systems rely on radio frequency (RF) mixed-mode electronics – those that integrate RF, analog, and digital circuits onto a single chip – to interface RF signals with digital processors. This technology supports critical communications, radar, and electronic warfare (EW) capabilities, as well as being widely used to support commercial telecommunications. The Department of Defense (DoD) has capability demands that far exceed the requirements of the commercial world in terms of speed, fidelity, capacity, and precision.
Over the past decade, DARPA’s investments in the advancement of Gallium Nitride (GaN) technology have helped enable the delivery of high power radio frequency (RF) signals at higher frequencies, bandwidths, and efficiencies. Today, however, a growing number of commercial and military components – from everyday smartphones to RF jammers – are generating a vast amount of RF signals, which is creating an increasingly crowded electromagnetic environment and a need to utilize higher operating frequencies – moving up to millimeter wave (mmW) frequencies
High performance mixed-signal electronics are essential to relaying analog wireless signals in the physical world with digital information for many Department of Defense (DoD) systems. The performance of these electronics directly affects overall system capabilities for defense systems that range from communications to electronic warfare (EW) and radio frequency (RF) sensors, as well as national telecommunications infrastructure applications.