Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 25 results for Microchips + Materials RSS
July 23-25, 2018,
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DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
July 15 – 17, 2019,
Detroit, MI
To jump-start innovation and foster forward-looking collaborations across the U.S. electronics community, DARPA’s Microsystems Technology Office will host a three-day event that will bring together those most impacted by the coming inflection in Moore’s Law. The 2019 ERI Summit will highlight the technical achievements of ERI programs, support continued research collaborations, and offer opportunities to solicit community input on new efforts.
The general-purpose computer has remained the dominant computing architecture for the last 50 years, driven largely by the relentless pace of Moore’s Law. As this trajectory shows signs of slowing, however, it has become increasingly more challenging to achieve performance gains from generalized hardware, setting the stage for a resurgence in specialized architectures. Today’s specialized, application-specific integrated circuits (ASICs) — hardware customized for a specific application — offer limited flexibility and are costly to design, fabricate, and program.
Over the past decade, DARPA’s investments in the advancement of Gallium Nitride (GaN) technology have helped enable the delivery of high power radio frequency (RF) signals at higher frequencies, bandwidths, and efficiencies. Today, however, a growing number of commercial and military components – from everyday smartphones to RF jammers – are generating a vast amount of RF signals, which is creating an increasingly crowded electromagnetic environment and a need to utilize higher operating frequencies – moving up to millimeter wave (mmW) frequencies
Next-generation intelligent systems supporting Department of Defense (DoD) applications like artificial intelligence, autonomous vehicles, shared spectrum communication, electronic warfare, and radar require processing efficiency that is orders of magnitude beyond what is available through current commercial electronics. Reaching the performance levels required by these DoD applications however will require developing highly complex system-on-chip (SoC) platforms that leverage the most advanced integrated circuit technologies.