Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 25 results for Microchips + Materials RSS
01/01/1972
Beginning in the mid-1970s, DARPA orchestrated extensive research into the semiconductor material gallium arsenide, which could host faster transistors operating at higher power than could silicon. The work would contribute to subsequent DARPA-spurred achievement in the 1980s to miniaturize receivers for GPS. That technology, in conjunction with DARPA-developed advances in inertial navigation, expanded the Nation’s arsenal of precision-guided munitions (PGMs) through such innovations as “bolt-on” Joint Direct Attack Munitions (JDAM) GPS kits, which gave otherwise unguided or laser-guided munitions new, high-precision capabilities. Key to these developments were gallium arsenide chips developed through DARPA’s Monolithic Microwave Integrated Circuit program, which also enabled the radio frequency (RF) and millimeter-wave circuits needed in precision weapons.
01/01/2012
Intrachip/Interchip Enhanced Cooling (ICECool) The increased density of electronic components and subsystems in military electronic systems exacerbates the thermal management challenges facing engineers. The military platforms that host these systems often cannot physically accommodate the large cooling systems needed for thermal management, meaning that heat can be a limiting factor for performance of electronics and embedded computers.
01/01/1989
The microelectronics revolution led to a ubiquity of fingernail-sized chips bearing integrated circuits made of large numbers of tiny transistors, interconnects, and other miniaturized components and devices. DARPA challenged the research community to achieve the tight integration of chips to the scale of the entire semiconductor wafer from which, normally, hundreds of chips would be diced and then packaged into separate components of electronic systems. Among the motivations were the expectations of higher computation or storage capability in a smaller volumes, higher-reliability systems; and reduced power consumption of the wafer-based systems. The research included work in materials, defect management, manufacturing techniques, among other areas. The approach opened up novel engineering opportunities particularly for fabricating multi-element, phased-array, antenna modules on gallium-arsenide wafer for both transmitting and receiving signals.
06/16/2016
A newly-announced DARPA program is betting that unprecedented on-chip integration of workhorse electronic components, such as transistors and capacitors, with less-familiar magnetic components with names like circulators and isolators, will open an expansive pathway to more capable electromagnetic systems. The Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC), program will orchestrate research into miniaturized magnetic components with a goal of catalyzing chip-based innovations in radar and other radio frequency (RF) systems—and satisfying growing military and civilian demands for new ways to maneuver within the increasingly crowded electromagnetic spectrum.
09/07/2017
DARPA published its Young Faculty Award (YFA) 2018 Research Announcement today, seeking proposals in 26 different topic areas—the largest number of YFA research areas ever solicited.