Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 22 results for Microchips + Manufacturing RSS
01/26/2017
Microelectronics support nearly all Department of Defense (DoD) activities, enabling capabilities such as the global positioning system, radar, command and control, and communications. Ensuring secure access to leading-edge microelectronics, however, is a challenge. The changing global semiconductor industry and the sophistication of U.S. adversaries, who might target military electronic components, suggest the need for an updated microelectronics security framework.
01/01/2012
Intrachip/Interchip Enhanced Cooling (ICECool) The increased density of electronic components and subsystems in military electronic systems exacerbates the thermal management challenges facing engineers. The military platforms that host these systems often cannot physically accommodate the large cooling systems needed for thermal management, meaning that heat can be a limiting factor for performance of electronics and embedded computers.
01/01/1981
To hasten development in the microelectronics arena of very large-scale integration (VLSI), DARPA funded Metal Oxide Silicon Implementation Service, or MOSIS. The service provided a fast-turnaround (four to ten weeks), low-cost ability to run limited batches of custom and semicustom microelectronic devices. By decoupling researchers from the need to have direct access to fabrication facilities and to negotiate the complexities of producing microelectronic chips, MOSIS opened innovation in this space to players who otherwise might have been precluded. A key aspect of MOSIS was the pooling of several chip designs onto a single semiconductor wafer. MOSIS opened for business in January 1981 and a MOSIS service was still available in nearly 40 years later.
01/01/1986
Beginning in 1987, the SEMATECH consortium received funding from the Federal Government to help revitalize the U.S. chipmaking industry. SEMATECH is an acronym that derives from Semiconductor Manufacturing Technology A decade after its founding, in 1997, the consortium was standing on its own without annual funding from the Government. It has since spawned other organizations, such as the International Semiconductor Manufacturing Initiative with a focus on manufacturing equipment and operations.
01/01/1989
The microelectronics revolution led to a ubiquity of fingernail-sized chips bearing integrated circuits made of large numbers of tiny transistors, interconnects, and other miniaturized components and devices. DARPA challenged the research community to achieve the tight integration of chips to the scale of the entire semiconductor wafer from which, normally, hundreds of chips would be diced and then packaged into separate components of electronic systems. Among the motivations were the expectations of higher computation or storage capability in a smaller volumes, higher-reliability systems; and reduced power consumption of the wafer-based systems. The research included work in materials, defect management, manufacturing techniques, among other areas. The approach opened up novel engineering opportunities particularly for fabricating multi-element, phased-array, antenna modules on gallium-arsenide wafer for both transmitting and receiving signals.