Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 26 results for Microchips + Integration RSS
04/05/2019
Since its official announcement on June 1, 2017, DARPA’s Electronics Resurgence Initiative (ERI) has sought to advance the development of a specialized, secure, and heavily automated electronics industry. ERI – a five-year, upwards of $1.5B investment to enable far-reaching improvements in electronics performance – has fostered collaborations among the commercial electronics sector, defense industrial base, and university researchers. As ERI enters its second year, DARPA seeks to reconvene the electronics community at the second annual ERI Summit in Detroit, Michigan, July 15–17. The Summit will allow electronics innovators to share their vision for the future, review technical progress, and provide input into future research directions.
05/31/2019
For the second year in a row, DARPA is convening the electronics community to discuss the ambitions and achievements of its five-year, upwards of $1.5 billion investment in U.S. microelectronics advancement. Attendees at the second annual Electronics Resurgence Initiative (ERI) Summit – being held July 15-17 in Detroit, Michigan – will hear from commercial and defense leaders as they share their insights on the domestic semiconductor industry and the applications driving next-generation electronics.
11/21/2019
Lasers are essential to many fields – ranging from optical communications and remote sensing, to manufacturing and medicine. While the semiconductor laser was first demonstrated nearly 60 years ago, advances in diode lasers and access to semiconductor fabrication techniques have enabled continued innovation and miniaturization of the technology. Photonic integrated circuits (PICs), which combine many photonic elements onto a single chip, have also transformed the way lasers and other optical systems are engineered, creating improvements in size, weight, and power (SWaP), system performance, and enabling new functionality. Despite these advances, a number of obstacles still hamper the proliferation of optical systems for defense and commercial applications.
July 23-25, 2018,
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DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
July 15 – 17, 2019,
Detroit, MI
To jump-start innovation and foster forward-looking collaborations across the U.S. electronics community, DARPA’s Microsystems Technology Office will host a three-day event that will bring together those most impacted by the coming inflection in Moore’s Law. The 2019 ERI Summit will highlight the technical achievements of ERI programs, support continued research collaborations, and offer opportunities to solicit community input on new efforts.