Showing 6 results for Microchips
The microelectronics revolution led to a ubiquity of fingernail-sized chips bearing integrated circuits made of large numbers of tiny transistors, interconnects, and other miniaturized components and devices. DARPA challenged the research community to achieve the tight integration of chips to the scale of the entire semiconductor wafer from which, normally, hundreds of chips would be diced and then packaged into separate components of electronic systems. Among the motivations were the expectations of higher computation or storage capability in a smaller volumes, higher-reliability systems; and reduced power consumption of the wafer-based systems. The research included work in materials, defect management, manufacturing techniques, among other areas. The approach opened up novel engineering opportunities particularly for fabricating multi-element, phased-array, antenna modules on gallium-arsenide wafer for both transmitting and receiving signals.