Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 21 results for Microchips + Complexity RSS
05/31/2019
For the second year in a row, DARPA is convening the electronics community to discuss the ambitions and achievements of its five-year, upwards of $1.5 billion investment in U.S. microelectronics advancement. Attendees at the second annual Electronics Resurgence Initiative (ERI) Summit – being held July 15-17 in Detroit, Michigan – will hear from commercial and defense leaders as they share their insights on the domestic semiconductor industry and the applications driving next-generation electronics.
06/17/2020
From August 18-20, DARPA will host its third Electronics Resurgence Initiative (ERI) Summit and Microsystems Technology Office (MTO) Symposium. The annual event brings together leaders from across the electronics ecosystem – spanning government, defense, academia, and industry – to foster collaboration and share technical progress on DARPA’s five-year, $1.5 billion dollar investment into the advancement of the U.S. semiconductor industry.
July 23-25, 2018,
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DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
The general-purpose computer has remained the dominant computing architecture for the last 50 years, driven largely by the relentless pace of Moore’s Law. As this trajectory shows signs of slowing, however, it has become increasingly more challenging to achieve performance gains from generalized hardware, setting the stage for a resurgence in specialized architectures. Today’s specialized, application-specific integrated circuits (ASICs) — hardware customized for a specific application — offer limited flexibility and are costly to design, fabricate, and program.
Over the past decade, DARPA’s investments in the advancement of Gallium Nitride (GaN) technology have helped enable the delivery of high power radio frequency (RF) signals at higher frequencies, bandwidths, and efficiencies. Today, however, a growing number of commercial and military components – from everyday smartphones to RF jammers – are generating a vast amount of RF signals, which is creating an increasingly crowded electromagnetic environment and a need to utilize higher operating frequencies – moving up to millimeter wave (mmW) frequencies.