Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 58 results for Microchips RSS
August 18-20, 2020,
Virtual Event
From August 18-20, DARPA will host its third Electronics Resurgence Initiative (ERI) Summit and Microsystems Technology Office (MTO) Symposium. The annual event brings together leaders from across the electronics ecosystem – spanning government, defense, academia, and industry – to foster collaboration and share technical progress on DARPA’s five-year, $1.5 billion dollar investment into the advancement of the U.S. semiconductor industry. To ensure the health and safety of the more than 1,000 expected attendees, the 2020 Summit will be hosted on a world-class, immersive, and entirely virtual platform with built-in features for live presentations, online interaction, exhibits, and networking.
November 20, 2019, 8:00 AM EST,
Executive Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting covering the new Lasers for Universal Microscale Optical Systems (LUMOS) program. The goal of LUMOS is to transform optical microsystems through the co-integration of direct-emission materials, such as InP, GaN, and GaAs, with low-loss dielectric materials such as silicon and silicon nitride to create accessible, manufacturable systems. LUMOS also seeks to leverage new concepts in nanophotonic structures, non-reciprocity, and nonlinear processes, as well as alternative materials that possess strong electro-optic and novel properties, such as thin-film lithium niobate, III-nitrides, and other advanced compounds that enable new component functionality. Finally, LUMOS seeks to illustrate the benefits of complete component integration by pursuing DoD-relevant system demonstrations with compelling gains in performance and significant size, weight, and power (SWaP) advantages over current state-of-the-art solutions.
November 1, 2018, 8:30 AM ET,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day to provide information to potential proposers on the objectives of the new program. PIPES will develop optical I/O for emerging data movement needs of commercial and military systems. PIPES seeks to emplace integrated optical transceiver capabilities into cutting-edge multi-chip modules (e.g., field-programmable gate arrays (FPGAs), graphical processing units (GPUs), central processing units (CPUs), and application-specific integrated circuits (ASICs)) for 2023-era microelectronics with performance well beyond currently available solutions. In parallel, PIPES aims to develop novel optical I/O approaches and advanced optical packaging and switching technologies to satisfy data movement demands of highly parallel systems in the 2028 timeframe. Additionally, the program will combine the advanced microelectronics capabilities of commercial industry, innovative photonics solutions from research communities, and DoD-specific application drivers from the defense industry into a framework for long-term technology availability by establishing and supporting a domestic technology ecosystem.
April 2, 2019,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting to provide information to potential proposers on the objectives of the new Real Time Machine Learning (RTML) program and to facilitate teaming. The principal objective of RTML is to reduce the design costs associated with developing Application-Specific Integrated Circuits (ASICs) tailored for emerging machine learning (ML) applications. Researchers on the program will develop a software platform capable of automatically generating novel chip designs based on ML frameworks.
It can cost up to $100 million and take more than two years for a large team of engineers to design custom integrated circuits for specific tasks, such as synchronizing the activity of unmanned aerial vehicles or the real-time conversion of raw radar data into tactically useful 3-D imagery. This is why Defense Department engineers often turn to inexpensive and readily available general-purpose circuits, and then rely on software to make those circuits run the specialized operations they need.