Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 50 results for Microchips RSS
November 1, 2018, 8:30 AM ET,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day to provide information to potential proposers on the objectives of the new program. PIPES will develop optical I/O for emerging data movement needs of commercial and military systems. PIPES seeks to emplace integrated optical transceiver capabilities into cutting-edge multi-chip modules (e.g., field-programmable gate arrays (FPGAs), graphical processing units (GPUs), central processing units (CPUs), and application-specific integrated circuits (ASICs)) for 2023-era microelectronics with performance well beyond currently available solutions. In parallel, PIPES aims to develop novel optical I/O approaches and advanced optical packaging and switching technologies to satisfy data movement demands of highly parallel systems in the 2028 timeframe. Additionally, the program will combine the advanced microelectronics capabilities of commercial industry, innovative photonics solutions from research communities, and DoD-specific application drivers from the defense industry into a framework for long-term technology availability by establishing and supporting a domestic technology ecosystem.
April 2, 2019,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting to provide information to potential proposers on the objectives of the new Real Time Machine Learning (RTML) program and to facilitate teaming. The principal objective of RTML is to reduce the design costs associated with developing Application-Specific Integrated Circuits (ASICs) tailored for emerging machine learning (ML) applications. Researchers on the program will develop a software platform capable of automatically generating novel chip designs based on ML frameworks.
It can cost up to $100 million and take more than two years for a large team of engineers to design custom integrated circuits for specific tasks, such as synchronizing the activity of unmanned aerial vehicles or the real-time conversion of raw radar data into tactically useful 3-D imagery. This is why Defense Department engineers often turn to inexpensive and readily available general-purpose circuits, and then rely on software to make those circuits run the specialized operations they need.
The explosive growth in mobile and telecommunication markets has pushed the semiconductor industry toward integration of digital, analog, and mixed-signal blocks into system-on-chip (SoC) solutions. Advanced silicon (Si) complementary metal oxide semiconductor (CMOS) technology has enabled this integration, but has also led to a rise in costs associated with design and processing. Driven by aggressive digital CMOS scaling for high-volume products, Intellectual Property (IP) reuse has emerged as a tool to help lower design costs associated with advanced SoCs.
The Direct On-Chip Digital Optical Synthesizer (DODOS) program seeks to create a technological revolution in optical frequency control analogous to the disruptive advances in microwave frequency control in the 1940s.