Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

Showing 58 results for Microchips RSS
05/31/2019
For the second year in a row, DARPA is convening the electronics community to discuss the ambitions and achievements of its five-year, upwards of $1.5 billion investment in U.S. microelectronics advancement. Attendees at the second annual Electronics Resurgence Initiative (ERI) Summit – being held July 15-17 in Detroit, Michigan – will hear from commercial and defense leaders as they share their insights on the domestic semiconductor industry and the applications driving next-generation electronics.
11/21/2019
Lasers are essential to many fields – ranging from optical communications and remote sensing, to manufacturing and medicine. While the semiconductor laser was first demonstrated nearly 60 years ago, advances in diode lasers and access to semiconductor fabrication techniques have enabled continued innovation and miniaturization of the technology. Photonic integrated circuits (PICs), which combine many photonic elements onto a single chip, have also transformed the way lasers and other optical systems are engineered, creating improvements in size, weight, and power (SWaP), system performance, and enabling new functionality. Despite these advances, a number of obstacles still hamper the proliferation of optical systems for defense and commercial applications.
02/04/2020
Today’s defense electronics systems rely on radio frequency (RF) mixed-mode electronics – those that integrate RF, analog, and digital circuits onto a single chip – to interface RF signals with digital processors. This technology supports critical communications, radar, and electronic warfare (EW) capabilities, as well as being widely used to support commercial telecommunications. The Department of Defense (DoD) has capability demands that far exceed the requirements of the commercial world in terms of speed, fidelity, capacity, and precision.
05/27/2020
As Internet of Things (IoT) devices rapidly increase in popularity and deployment, economic attackers and nation-states alike are shifting their attention to the vulnerabilities of digital integrated circuit (IC) chips. Threats to IC chips are well known, and despite various measures designed to mitigate them, hardware developers have largely been slow to implement security solutions due to limited expertise, high cost and complexity, and lack of security-oriented design tools integrated with supporting semiconductor intellectual property (IP).
06/17/2020
From August 18-20, DARPA will host its third Electronics Resurgence Initiative (ERI) Summit and Microsystems Technology Office (MTO) Symposium. The annual event brings together leaders from across the electronics ecosystem – spanning government, defense, academia, and industry – to foster collaboration and share technical progress on DARPA’s five-year, $1.5 billion dollar investment into the advancement of the U.S. semiconductor industry.