Defense Advanced Research Projects AgencyTagged Content List

Microchips and Components

Relating to miniaturized electronic circuitry and its components and features

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High performance mixed-signal electronics are essential to relaying analog wireless signals in the physical world with digital information for many Department of Defense (DoD) systems. The performance of these electronics directly affects overall system capabilities for defense systems that range from communications to electronic warfare (EW) and radio frequency (RF) sensors, as well as national telecommunications infrastructure applications.
Deployed electronic systems increasingly require advanced processing capabilities, however the time and power required to access system memory – commonly referred to as the “memory bottleneck” – takes a significant toll on their performance. Any substantial improvement in electronic system performance will require a radical reduction in memory access time and overall dynamic power of the system. The use of a monolithic three-dimensional system-on-chip (SoC) stack to integrate memory and logic is one approach that could dramatically alter the memory bottleneck challenge.
In June 2017, DARPA announced the Electronics Resurgence Initiative (ERI) as a bold response to several technical and economic trends in the microelectronics sector. Among these trends, the rapid increase in the cost and complexity of advanced microelectronics design and manufacture is challenging a half-century of progress under Moore’s Law, prompting a need for alternative approaches to traditional transistor scaling.