Defense Advanced Research Projects AgencyTagged Content List


A process or rule set used for calculations or other problem-solving operations

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Machine learning (ML) systems today learn by example, ingesting tons of data that has been individually labeled by human analysts to generate a desired output. As these systems have progressed, deep neural networks (DNN) have emerged as the state of the art in ML models. DNN are capable of powering tasks like machine translation and speech or object recognition with a much higher degree of accuracy. However, training DNN requires massive amounts of labeled data–typically 109 or 1010 training examples. The process of amassing and labeling this mountain of information is costly and time consuming.
A once highly manual process, circuit design has been transformed by the advent of electronic design automation (EDA) tools and modular design methodologies. Despite continuing advances in automation technologies, the demand for increasingly complex System-on-Chip (SoC) platforms has shown no sign of slowing. Today’s SoCs incorporate billions of transistors with miles of electrical wiring that are integrated within a tiny chip.
The use of intellectual-property (IP) blocks–discrete, modular, reusable blocks that deliver frequently used circuit functions—has significantly streamlined the design and creation of microchips. Just as the number of transistors per chip has grown dramatically in line with Moore’s Law—the transistor scaling that has allowed for 50 years of electronics advancement–so too has the number of IP blocks on those same chips.
Over its 60-year history, DARPA has played a leading role in the creation and advancement of artificial intelligence (AI) technologies that have produced game-changing capabilities for the Department of Defense. Starting in the 1960s, DARPA research shaped the first wave of AI technologies, which focused on handcrafted knowledge, or rule-based systems capable of narrowly defined tasks. While a critical step forward for the field, these systems were fragile and limited.
July 23-25, 2018,
DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.