Defense Advanced Research Projects AgencyTagged Content List

Transformative Materials

Relating to new or improved properties in materials

Showing 48 results for Materials + Manufacturing RSS
05/31/2019
For the second year in a row, DARPA is convening the electronics community to discuss the ambitions and achievements of its five-year, upwards of $1.5 billion investment in U.S. microelectronics advancement. Attendees at the second annual Electronics Resurgence Initiative (ERI) Summit – being held July 15-17 in Detroit, Michigan – will hear from commercial and defense leaders as they share their insights on the domestic semiconductor industry and the applications driving next-generation electronics.
July 23-25, 2018,
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DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
January 22, 2019,
Executive Conference Center
The Defense Sciences Office is holding a Proposers Day meeting and webcast to provide information to potential proposers on the objectives of the new Materials Architectures and Characterization for Hypersonics (MACH) program. MACH seeks to develop new materials and designs for cooling the hot leading edges of hypersonic vehicles traveling more than five times the speed of sound.
Manufacturing by assembly provides the flexibility to freely combine materials and components and is fundamental to creating devices from cell phones to appliances to airplanes. However, assembly processes are currently not practical at the nanoscale. The A2P program was conceived to deliver scalable technologies for assembly of nanometer- to micron-scale components—which frequently possess unique characteristics due to their small size—into larger, human-scale systems.
The general-purpose computer has remained the dominant computing architecture for the last 50 years, driven largely by the relentless pace of Moore’s Law. As this trajectory shows signs of slowing, however, it has become increasingly more challenging to achieve performance gains from generalized hardware, setting the stage for a resurgence in specialized architectures. Today’s specialized, application-specific integrated circuits (ASICs) — hardware customized for a specific application — offer limited flexibility and are costly to design, fabricate, and program.