Defense Advanced Research Projects AgencyTagged Content List

Transformative Materials

Relating to new or improved properties in materials

Showing 47 results for Materials + Manufacturing RSS
07/24/2018
The use of intellectual-property (IP) blocks–discrete, modular, reusable blocks that deliver frequently used circuit functions—has significantly streamlined the design and creation of microchips. Just as the number of transistors per chip has grown dramatically in line with Moore’s Law—the transistor scaling that has allowed for 50 years of electronics advancement–so too has the number of IP blocks on those same chips.
11/01/2018
First announced in June 2017, DARPA’s Electronics Resurgence Initiative (ERI) – a five-year, upwards of $1.5B investment in the future of domestic electronic systems – is rolling out the second phase of its research priorities. Comprised of several ongoing DARPA programs – including the six recently awarded ERI “Page 3” programs –ERI addresses long-foreseen obstacles to Moore’s Law and the challenges impeding 50 years of rapid progress in electronics advancement. The next phase of ERI will focus on further enmeshing the technology needs and capabilities of the defense enterprise with the commercial and manufacturing realities of the electronics industry.
12/10/2018
Today’s critical Department of Defense (DOD) systems and platforms rely on advanced electronics to address national security objectives. To help tackle obstacles facing a half-century of electronics advancement, DARPA launched the Electronics Resurgence Initiative (ERI) – a five-year, upwards of $1.5 billion investment in the future of domestic electronic systems. In November, DARPA expanded ERI with the announcement of ERI Phase II, which seeks to further enmesh the technology needs and capabilities of the defense enterprise with the commercial and manufacturing realities of the electronics industry.
12/17/2018
Hypersonic vehicles fly through the atmosphere at incredibly high speeds, creating intense friction with the surrounding air as they travel at Mach 5 or above – five times faster than sound travels. Developing structures that can withstand furnace-like temperatures at such high speeds is a technical challenge, especially for leading edges that bear the brunt of the heat.
04/05/2019
Since its official announcement on June 1, 2017, DARPA’s Electronics Resurgence Initiative (ERI) has sought to advance the development of a specialized, secure, and heavily automated electronics industry. ERI – a five-year, upwards of $1.5B investment to enable far-reaching improvements in electronics performance – has fostered collaborations among the commercial electronics sector, defense industrial base, and university researchers. As ERI enters its second year, DARPA seeks to reconvene the electronics community at the second annual ERI Summit in Detroit, Michigan, July 15–17. The Summit will allow electronics innovators to share their vision for the future, review technical progress, and provide input into future research directions.