Defense Advanced Research Projects AgencyTagged Content List

Transformative Materials

Relating to new or improved properties in materials

Showing 47 results for Materials + Manufacturing RSS
Between 1968 and 1972, ARPA supported an effort proposed by the University of Denver to use explosives for forming metal parts for aerospace applications. The underwater process relied on a mold for the part over which was placed a plate of the metal alloy to be used. This preparation, when immersed in water, would feel the shock of an explosive charge to such a degree that the metal plate would be forced against the die. The process could reproducibly deliver serviceable parts out of steel, aluminum, titanium, and Inconel, a superalloy. The effort opened a new way to produce a variety made of aerospace components, including engine parts such as engine diffusers and afterburner rings for Pratt &Whitney engines that powered the storied SR71. The variation of the process also was deployed for many years to weld superstructures to the decks of U.S. Navy warships.
Intrachip/Interchip Enhanced Cooling (ICECool) The increased density of electronic components and subsystems in military electronic systems exacerbates the thermal management challenges facing engineers. The military platforms that host these systems often cannot physically accommodate the large cooling systems needed for thermal management, meaning that heat can be a limiting factor for performance of electronics and embedded computers.
New materials that perform better than previous ones or with unprecedented properties open pathways to new and improved technologies. F-15 and F-16 fighter aircraft, still in use by the U.S. Air Force today, owe much of their performance advancements to materials technologies that emerged from DARPA materials development programs conducted in the 1970s and early 1980s. One of many notable successes from these efforts was the development of rare-earth permanent magnets with magnetic strengths far stronger than conventional magnetic materials and, in some cases, over larger operational conditions. The samarium- and cobalt-based rare-earth magnetic material Sm2Co17, for example, remains reliable over the entire militarily relevant temperature range of -55°C to 125°C. These magnets ultimately assumed a role in a key component of the AN/ALQ-135 electronic warfare system, permitting operation of the F-15 to 70,000 feet in altitude.
The microelectronics revolution led to a ubiquity of fingernail-sized chips bearing integrated circuits made of large numbers of tiny transistors, interconnects, and other miniaturized components and devices. DARPA challenged the research community to achieve the tight integration of chips to the scale of the entire semiconductor wafer from which, normally, hundreds of chips would be diced and then packaged into separate components of electronic systems. Among the motivations were the expectations of higher computation or storage capability in a smaller volumes, higher-reliability systems; and reduced power consumption of the wafer-based systems. The research included work in materials, defect management, manufacturing techniques, among other areas. The approach opened up novel engineering opportunities particularly for fabricating multi-element, phased-array, antenna modules on gallium-arsenide wafer for both transmitting and receiving signals.
Military platforms—such as ships, aircraft and ground vehicles—rely on advanced materials to make them lighter, stronger and more resistant to stress, heat and other harsh environmental conditions. Currently, the process for developing new materials to field in platforms frequently takes more than a decade. This lengthy process often means that developers of new military platforms are forced to rely on decades-old, mature materials because potentially more advanced materials are still being tested and aren’t ready to be implemented into platform designs.