Defense Advanced Research Projects AgencyTagged Content List

Transformative Materials

Relating to new or improved properties in materials

Showing 24 results for Materials + Integration RSS
01/13/2017
In this episode DARPA’s podcast, MTO program manager Dan Green discusses the Agency’s work to develop semiconductor materials, among them gallium arsenide and now gallium nitride, that open pathways to both military and civilian technology in categories spanning from electronic warfare to radar to communications.
09/13/2017
With the official roll out of the Electronics Resurgence Initiative’s latest investments today, DARPA hopes to open new innovation pathways to address impending engineering and economics challenges that, if left unanswered, could challenge what has been a relentless half-century run of progress in microelectronics technology. To maintain healthy forward momentum, the ERI over the next four years will commit hundreds of millions of dollars to nurture research in advanced new materials, circuit design tools, and system architectures. In addition to a half-dozen or so existing DARPA programs, and the largest program in the U.S. that funds basic electronics research at universities, 
04/06/2018
The microelectronics community is facing an array of long foreseen obstacles to Moore’s Law, the transistor scaling that has allowed for 50 years of rapid progress in electronics. Current economic, geopolitical, and physics-based complications make the future of the electronics industry uniquely interesting at this moment. To jump-start innovation in the field, DARPA announced in June 2017 that it would coalesce a broad series of programs into the Electronics Resurgence Initiative (ERI).
06/26/2018
First announced in June 2017, DARPA’s Electronics Resurgence Initiative (ERI) is a multi-year, upwards of $1.5 billion investment in jumpstarting innovation and collaboration across the U.S. electronics community to address an array of long foreseen challenges to Moore’s Law. To kickoff this community-wide effort, DARPA is hosting its first annual ERI Summit from July 23-25 in San Francisco, CA. The three-day event will bring together leading voices from across the electronics community–including Alphabet, Applied Materials, Intel, Synopsys, Cadence, Mentor Graphics, NVIDIA, and IBM–to address challenges and opportunities for the next half century of electronics progress.
07/24/2018
A once highly manual process, circuit design has been transformed by the advent of electronic design automation (EDA) tools and modular design methodologies. Despite continuing advances in automation technologies, the demand for increasingly complex System-on-Chip (SoC) platforms has shown no sign of slowing. Today’s SoCs incorporate billions of transistors with miles of electrical wiring that are integrated within a tiny chip.