Defense Advanced Research Projects AgencyTagged Content List

Manufacturing

Manufacturing

Showing 78 results for Manufacturing RSS
08/07/2019
The tremendous ability of the U.S. military to project power entails an equally imposing logistical chain to maintain stocks of food, water, medicines, fuel, and other supplies critical to troops and equipment. That chain gets stretched to extremes when the military is called upon to rapidly deploy anywhere in the world and sustain operations without the benefit of fixed infrastructure.
11/21/2019
Lasers are essential to many fields – ranging from optical communications and remote sensing, to manufacturing and medicine. While the semiconductor laser was first demonstrated nearly 60 years ago, advances in diode lasers and access to semiconductor fabrication techniques have enabled continued innovation and miniaturization of the technology. Photonic integrated circuits (PICs), which combine many photonic elements onto a single chip, have also transformed the way lasers and other optical systems are engineered, creating improvements in size, weight, and power (SWaP), system performance, and enabling new functionality. Despite these advances, a number of obstacles still hamper the proliferation of optical systems for defense and commercial applications.
July 23-25, 2018,
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DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
August 13, 2019, 9:00 AM ET,
Executive Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting to provide information to potential proposers on the objectives of the new FOcal arrays for Curved Infrared Imagers (FOCII) program and to facilitate teaming. The goal of the program is to develop and demonstrate technologies for curving existing state-of-the-art, large-format, high-performance infrared focal plane arrays (FPAs) to a small radius of curvature (ROC) to maximize performance, as well as curve smaller format FPAs to an extreme ROC to enable the smallest form factors possible while maintaining exquisite performance.
November 20, 2019, 8:00 AM EST,
Executive Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting covering the new Lasers for Universal Microscale Optical Systems (LUMOS) program. The goal of LUMOS is to transform optical microsystems through the co-integration of direct-emission materials, such as InP, GaN, and GaAs, with low-loss dielectric materials such as silicon and silicon nitride to create accessible, manufacturable systems. LUMOS also seeks to leverage new concepts in nanophotonic structures, non-reciprocity, and nonlinear processes, as well as alternative materials that possess strong electro-optic and novel properties, such as thin-film lithium niobate, III-nitrides, and other advanced compounds that enable new component functionality. Finally, LUMOS seeks to illustrate the benefits of complete component integration by pursuing DoD-relevant system demonstrations with compelling gains in performance and significant size, weight, and power (SWaP) advantages over current state-of-the-art solutions.