Defense Advanced Research Projects AgencyTagged Content List


Compatible interconnection of disparate components and systems

Showing 25 results for Integration + Programs RSS
Efficient discovery and production of new molecules is essential to realize capabilities across the DoD, from simulants and medicines essential to counter emerging threats, to coatings, dyes and specialty fuels needed for advanced performance.
Unmanned underwater vehicles (UUVs) have inherent operational and tactical advantages such as stealth and surprise. UUV size, weight and volume are constrained by the handling, launch and recovery systems on their host platforms, however, and UUV range is limited by the amount of energy available for propulsion and the power required for a given underwater speed. Current state-of-the-art energy sources are limited by safety and certification requirements for host platforms.
The explosive growth in mobile and telecommunication markets has pushed the semiconductor industry toward integration of digital, analog, and mixed-signal blocks into system-on-chip (SoC) solutions. Advanced silicon (Si) complementary metal oxide semiconductor (CMOS) technology has enabled this integration, but has also led to a rise in costs associated with design and processing. Driven by aggressive digital CMOS scaling for high-volume products, Intellectual Property (IP) reuse has emerged as a tool to help lower design costs associated with advanced SoCs.
The Direct On-Chip Digital Optical Synthesizer (DODOS) program seeks to create a technological revolution in optical frequency control analogous to the disruptive advances in microwave frequency control in the 1940s.
Complex Defense systems, such as RADAR, communications, imaging and sensing systems rely on a wide variety of microsystems devices and materials. These diverse devices and materials typically require different substrates and different processing technologies, preventing the integration of these devices into single fabrication process flows. Thus, integration of these device technologies has historically occurred only at the chip-to-chip level, which introduces significant bandwidth and latency-related performance limitations on these systems, as well as increased size, weight, power, and packaging/assembly costs as compared to microsystems fully integrated on a single chip.