Defense Advanced Research Projects AgencyTagged Content List

Integration

Compatible interconnection of disparate components and systems

Showing 34 results for Integration + News RSS
12/10/2018
Today’s critical Department of Defense (DOD) systems and platforms rely on advanced electronics to address national security objectives. To help tackle obstacles facing a half-century of electronics advancement, DARPA launched the Electronics Resurgence Initiative (ERI) – a five-year, upwards of $1.5 billion investment in the future of domestic electronic systems. In November, DARPA expanded ERI with the announcement of ERI Phase II, which seeks to further enmesh the technology needs and capabilities of the defense enterprise with the commercial and manufacturing realities of the electronics industry.
04/05/2019
Since its official announcement on June 1, 2017, DARPA’s Electronics Resurgence Initiative (ERI) has sought to advance the development of a specialized, secure, and heavily automated electronics industry. ERI – a five-year, upwards of $1.5B investment to enable far-reaching improvements in electronics performance – has fostered collaborations among the commercial electronics sector, defense industrial base, and university researchers. As ERI enters its second year, DARPA seeks to reconvene the electronics community at the second annual ERI Summit in Detroit, Michigan, July 15–17. The Summit will allow electronics innovators to share their vision for the future, review technical progress, and provide input into future research directions.
05/31/2019
For the second year in a row, DARPA is convening the electronics community to discuss the ambitions and achievements of its five-year, upwards of $1.5 billion investment in U.S. microelectronics advancement. Attendees at the second annual Electronics Resurgence Initiative (ERI) Summit – being held July 15-17 in Detroit, Michigan – will hear from commercial and defense leaders as they share their insights on the domestic semiconductor industry and the applications driving next-generation electronics.
11/21/2019
Lasers are essential to many fields – ranging from optical communications and remote sensing, to manufacturing and medicine. While the semiconductor laser was first demonstrated nearly 60 years ago, advances in diode lasers and access to semiconductor fabrication techniques have enabled continued innovation and miniaturization of the technology. Photonic integrated circuits (PICs), which combine many photonic elements onto a single chip, have also transformed the way lasers and other optical systems are engineered, creating improvements in size, weight, and power (SWaP), system performance, and enabling new functionality. Despite these advances, a number of obstacles still hamper the proliferation of optical systems for defense and commercial applications.
03/16/2020
Advances in digital microelectronics have enabled indispensable capabilities for the Department of Defense (DoD) in the fields of information processing, sensors, and communications. Increasingly, system performance in these domains is constrained not by the limits of computation at individual chips, but rather by the electrical data movement between them. The energy efficiency and data bandwidth of electrical interconnects between integrated circuits (ICs) has failed to keep pace with improvements in transistor technology. To address this challenge, DARPA developed the Photonics in the Package for Extreme Scalability (PIPES) program, which aims to expand the use of optical signaling for data transfer and place high-bandwidth photonics within the package of application-specific integrated circuits (ASICs) and field-programmable gate arrays (FPGAs).