Defense Advanced Research Projects AgencyTagged Content List

Integration

Compatible interconnection of disparate components and systems

Showing 34 results for Integration + News RSS
06/17/2016
Military commanders responsible for situational awareness and command and control of assets in space know all too well the challenge that comes from the vast size of the space domain. The volume of Earth’s operational space domain is hundreds of thousands times larger than the Earth’s oceans. It contains thousands of objects hurtling at tens of thousands of miles per hour. The scales and speeds in this extreme environment are difficult enough to grasp conceptually, let alone operationally, as is required for commanders overseeing the nation’s increasingly critical space assets.
06/29/2016
More than 500,000 pieces of manmade space debris—including spent rocket stages, defunct satellites, and fragments as small as flecks of paint—currently hurtle around the Earth at roughly 17,000 miles per hour. At those speeds, impacts involving even the smallest of those items can damage satellites and spawn chain reactions of collisions, increasing the amount of orbital flotsam and creating “minefields” in space that can remain unpassable for centuries.
07/19/2016
Open the hood of just about any electronic gadget and you probably will find one or more printed circuit boards (PCBs)—most often in a leaf green color—studded with processing, memory, data-relaying, graphics, and other types of chips and components, all interconnected with a labyrinth of finely embossed wiring. By challenging the technology community to integrate the collective functions hosted by an entire PCB onto a device the size of a single chip, DARPA’s newest program is making a bid to usher in a fresh dimension of technology miniaturization.
09/13/2017
With the official roll out of the Electronics Resurgence Initiative’s latest investments today, DARPA hopes to open new innovation pathways to address impending engineering and economics challenges that, if left unanswered, could challenge what has been a relentless half-century run of progress in microelectronics technology. To maintain healthy forward momentum, the ERI over the next four years will commit hundreds of millions of dollars to nurture research in advanced new materials, circuit design tools, and system architectures. In addition to a half-dozen or so existing DARPA programs, and the largest program in the U.S. that funds basic electronics research at universities, 
01/09/2018
The growing complexity of space operations coupled with an increased need for timely decisions demands innovative approaches to battle management command and control (BMC2) technologies. To help ensure future U.S. technological and strategic superiority, DARPA’s Hallmark program seeks to develop revolutionary tools and technologies to plan, assess, and execute U.S. military operations in space. The program has completed initial research and awarded Phase 1 contracts to 11 organizations, which both augment existing commercial technologies and pursue entirely new capabilities. Hallmark has released a Broad Agency Announcement seeking additional technologies for potential inclusion.