Defense Advanced Research Projects AgencyTagged Content List

Integration

Compatible interconnection of disparate components and systems

Showing 24 results for Integration + Materials RSS
Deployed electronic systems increasingly require advanced processing capabilities, however the time and power required to access system memory – commonly referred to as the “memory bottleneck” – takes a significant toll on their performance. Any substantial improvement in electronic system performance will require a radical reduction in memory access time and overall dynamic power of the system. The use of a monolithic three-dimensional system-on-chip (SoC) stack to integrate memory and logic is one approach that could dramatically alter the memory bottleneck challenge.
08/30/2017
In June 2017, DARPA announced the Electronics Resurgence Initiative (ERI) as a bold response to several technical and economic trends in the microelectronics sector. Among these trends, the rapid increase in the cost and complexity of advanced microelectronics design and manufacture is challenging a half-century of progress under Moore’s Law, prompting a need for alternative approaches to traditional transistor scaling.
03/13/2022
This announcement seeks revolutionary research ideas for topics not being addressed by ongoing DARPA MTO programs or other published solicitations.
07/10/2020
MTO seeks to develop high-risk, high-reward technologies that enable revolutionary advances in materials, devices, and systems and continue DARPA's mission of creating and preventing strategic surprise. In order to capitalize rapidly on new opportunities, DARPA announces the Microsystems Exploration program which calls for faster responses with smaller, targeted investments. Microsystems Exploration awards will be made within 90 days of each Microsystems Exploration topic (μE) announcement.