Defense Advanced Research Projects AgencyTagged Content List

Integration

Compatible interconnection of disparate components and systems

Showing 24 results for Integration + Materials RSS
05/31/2019
For the second year in a row, DARPA is convening the electronics community to discuss the ambitions and achievements of its five-year, upwards of $1.5 billion investment in U.S. microelectronics advancement. Attendees at the second annual Electronics Resurgence Initiative (ERI) Summit – being held July 15-17 in Detroit, Michigan – will hear from commercial and defense leaders as they share their insights on the domestic semiconductor industry and the applications driving next-generation electronics.
July 23-25, 2018,
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DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
July 15 – 17, 2019,
Detroit, MI
To jump-start innovation and foster forward-looking collaborations across the U.S. electronics community, DARPA’s Microsystems Technology Office will host a three-day event that will bring together those most impacted by the coming inflection in Moore’s Law. The 2019 ERI Summit will highlight the technical achievements of ERI programs, support continued research collaborations, and offer opportunities to solicit community input on new efforts.
The general-purpose computer has remained the dominant computing architecture for the last 50 years, driven largely by the relentless pace of Moore’s Law. As this trajectory shows signs of slowing, however, it has become increasingly more challenging to achieve performance gains from generalized hardware, setting the stage for a resurgence in specialized architectures. Today’s specialized, application-specific integrated circuits (ASICs) — hardware customized for a specific application — offer limited flexibility and are costly to design, fabricate, and program.
The proliferation of low cost, highly sophisticated commercial technology and the global access to knowledge about how to construct and apply these systems has narrowed the divide and placed sophisticated systems and capabilities in the hands of hobbyists across the world. The DARPA Improv program investigated the threat posed by commercial-off-the-shelf (COTS) devices.