Defense Advanced Research Projects AgencyTagged Content List

Integration

Compatible interconnection of disparate components and systems

Showing 84 results for Integration RSS
August 18-20, 2020,
Virtual Event
From August 18-20, DARPA will host its third Electronics Resurgence Initiative (ERI) Summit and Microsystems Technology Office (MTO) Symposium. The annual event brings together leaders from across the electronics ecosystem – spanning government, defense, academia, and industry – to foster collaboration and share technical progress on DARPA’s five-year, $1.5 billion dollar investment into the advancement of the U.S. semiconductor industry. To ensure the health and safety of the more than 1,000 expected attendees, the 2020 Summit will be hosted on a world-class, immersive, and entirely virtual platform with built-in features for live presentations, online interaction, exhibits, and networking.
January 30, 2018,
DARPA Conference Center
DARPA’s Tactical Technology Office is hosting a Proposers Day meeting to provide information to potential applicants on the objectives of Its new Broad Agency Announcement, Hallmark Tools and Capabilities 2 (Hallmark-TC2), part of the existing Hallmark program. Hallmark-TC2 aims to develop and validate additional technologies to complement and augment the original Hallmark tools and capabilities currently being integrated into Hallmark software testbeds.
November 20, 2019, 8:00 AM EST,
Executive Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting covering the new Lasers for Universal Microscale Optical Systems (LUMOS) program. The goal of LUMOS is to transform optical microsystems through the co-integration of direct-emission materials, such as InP, GaN, and GaAs, with low-loss dielectric materials such as silicon and silicon nitride to create accessible, manufacturable systems. LUMOS also seeks to leverage new concepts in nanophotonic structures, non-reciprocity, and nonlinear processes, as well as alternative materials that possess strong electro-optic and novel properties, such as thin-film lithium niobate, III-nitrides, and other advanced compounds that enable new component functionality. Finally, LUMOS seeks to illustrate the benefits of complete component integration by pursuing DoD-relevant system demonstrations with compelling gains in performance and significant size, weight, and power (SWaP) advantages over current state-of-the-art solutions.
November 1, 2018, 8:30 AM ET,
DARPA Conference Center
The Microsystems Technology Office is holding a Proposers Day to provide information to potential proposers on the objectives of the new program. PIPES will develop optical I/O for emerging data movement needs of commercial and military systems. PIPES seeks to emplace integrated optical transceiver capabilities into cutting-edge multi-chip modules (e.g., field-programmable gate arrays (FPGAs), graphical processing units (GPUs), central processing units (CPUs), and application-specific integrated circuits (ASICs)) for 2023-era microelectronics with performance well beyond currently available solutions. In parallel, PIPES aims to develop novel optical I/O approaches and advanced optical packaging and switching technologies to satisfy data movement demands of highly parallel systems in the 2028 timeframe. Additionally, the program will combine the advanced microelectronics capabilities of commercial industry, innovative photonics solutions from research communities, and DoD-specific application drivers from the defense industry into a framework for long-term technology availability by establishing and supporting a domestic technology ecosystem.
August 12, 2019, 8:30 AM ET,
DARPA Conference Center
The Information Innovation Office is holding a Proposers Day meeting to provide information to potential proposers on the objectives of the new Symbiotic Design for Cyber Physical Systems program and to facilitate teaming. The goal of the program is to develop AI-based approaches to enable correct-by-construction design of military-relevant, cyber-physical systems (CPS), in order to reduce the time from their inception to deployment from years to months, and enhance innovation in design. These approaches would complement and augment existing model-based design technologies, and enable humans and computers to collaborate on correct-by-construction design of CPS.