Defense Advanced Research Projects AgencyTagged Content List

Integration

Compatible interconnection of disparate components and systems

Showing 76 results for Integration RSS
September 21, 2016,
Westin Tysons Corner
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is sponsoring a Proposers Day to provide information to potential proposers on the objectives of an anticipated Broad Agency Announcement (BAA) for the Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. The Proposers Day will be held on September 21, 2016, from 8:00 AM to 5:00 PM EDT at the Westin Tysons Corner in Falls Church, VA.
July 23-25, 2018,
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DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
July 15 – 17, 2019,
Detroit, MI
To jump-start innovation and foster forward-looking collaborations across the U.S. electronics community, DARPA’s Microsystems Technology Office will host a three-day event that will bring together those most impacted by the coming inflection in Moore’s Law. The 2019 ERI Summit will highlight the technical achievements of ERI programs, support continued research collaborations, and offer opportunities to solicit community input on new efforts.
January 30, 2018,
DARPA Conference Center
DARPA’s Tactical Technology Office is hosting a Proposers Day meeting to provide information to potential applicants on the objectives of Its new Broad Agency Announcement, Hallmark Tools and Capabilities 2 (Hallmark-TC2), part of the existing Hallmark program. Hallmark-TC2 aims to develop and validate additional technologies to complement and augment the original Hallmark tools and capabilities currently being integrated into Hallmark software testbeds.
November 20, 2019, 8:00 AM EST,
Executive Conference Center
The Microsystems Technology Office is holding a Proposers Day meeting covering the new Lasers for Universal Microscale Optical Systems (LUMOS) program. The goal of LUMOS is to transform optical microsystems through the co-integration of direct-emission materials, such as InP, GaN, and GaAs, with low-loss dielectric materials such as silicon and silicon nitride to create accessible, manufacturable systems. LUMOS also seeks to leverage new concepts in nanophotonic structures, non-reciprocity, and nonlinear processes, as well as alternative materials that possess strong electro-optic and novel properties, such as thin-film lithium niobate, III-nitrides, and other advanced compounds that enable new component functionality. Finally, LUMOS seeks to illustrate the benefits of complete component integration by pursuing DoD-relevant system demonstrations with compelling gains in performance and significant size, weight, and power (SWaP) advantages over current state-of-the-art solutions.