Defense Advanced Research Projects AgencyTagged Content List

Imagery and Visualization

Visual representations of data and information

Showing 4 results for Imagery + SWAP RSS
12/04/2015
Find a way to replace a large, heavy and expensive technology with an equivalent one that’s a lot smaller, lighter and cheaper and you have a shot at turning a boutique technology into a world changer. Think of the room-sized computers of the 1940s that now are outpowered by the run-of-the-mill central processing unit in laptop computers. Or the miniaturized GPS components that contribute geolocation smartness in cell phones. DARPA program manager Joshua Conway has another shrinking act in mind: packing the light-catching powers of bulky lens-filled telescopes onto flat, semiconductor wafers that are saucer-sized or smaller, featherweight and cheap to make.
December 17, 2015,
DARPA Conference Center
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is hosting a Proposers Day to provide information to potential proposers on the objectives that will be specified in an anticipated Broad Agency Announcement (BAA) of the Modular Optical Apertures Building Blocks (MOABB) program. The MOAB program aims to develop advanced technologies that could catalyze the creation of ultracompact light detection and ranging (LIDAR) systems.
The Low Cost Thermal Imager - Manufacturing (LCTI-M) program seeks to enable widespread use of infrared imaging (IR) technology by individual warfighters, with a special focus on affordability and ease of use for dismounted soldiers and individual intelligence personnel, for whom situational awareness and instant sharing of information is critical. IR imaging has the capability to “see” through obscurants, providing valuable information even in environments with severely degraded visibility. Low-cost infrared cameras would empower each warfighter with this essential capability and could open the way to new tactical procedures that demand a common view of the battlefield.
The low cost of digital imaging devices has allowed them to become ubiquitous consumer products. This low cost is made possible by leveraging a mature complementary metal oxide semiconductor (CMOS) processing infrastructure and the ability to fabricate complete focal plane arrays (FPAs) at the wafer scale. A similar trend is occurring at a smaller scale with thermal imaging technologies. Microbolometers that are sensitive in the LWIR spectrum are also manufactured at the wafer scale and the resulting cost reduction is enabling thermal imagers at consumer-grade price points.