Defense Advanced Research Projects AgencyTagged Content List

Harnessing Complexity

Systems comprising multiple and diverse interactions

Showing 22 results for Complexity + Manufacturing RSS
08/14/2015
For millennia, materials have mattered—so much so that entire eras have been named for them. From the Stone Age to the Bronze Age to the Iron Age and beyond, breakthroughs in materials have defined what was technologically possible and fueled revolutions in fields as diverse as electronics, construction and medicine. Today, DARPA is pursuing the next big advances in this fundamentally important domain.
09/14/2015
The manufacturing process for defense systems—from aircraft to vehicles to ships—is extremely complex and fragmented, often demanding unique materials and processes, complex certification requirements and specifications, and specialized tools and equipment. The almost inevitable result: lengthy production timelines and high costs. The manufacture of diverse small parts for military systems could be made simpler, faster, and less expensive with the development of a tailorable composite feedstock material and a single tailorable forming method.
09/13/2017
With the official roll out of the Electronics Resurgence Initiative’s latest investments today, DARPA hopes to open new innovation pathways to address impending engineering and economics challenges that, if left unanswered, could challenge what has been a relentless half-century run of progress in microelectronics technology. To maintain healthy forward momentum, the ERI over the next four years will commit hundreds of millions of dollars to nurture research in advanced new materials, circuit design tools, and system architectures. In addition to a half-dozen or so existing DARPA programs, and the largest program in the U.S. that funds basic electronics research at universities, 
06/26/2018
First announced in June 2017, DARPA’s Electronics Resurgence Initiative (ERI) is a multi-year, upwards of $1.5 billion investment in jumpstarting innovation and collaboration across the U.S. electronics community to address an array of long foreseen challenges to Moore’s Law. To kickoff this community-wide effort, DARPA is hosting its first annual ERI Summit from July 23-25 in San Francisco, CA. The three-day event will bring together leading voices from across the electronics community–including Alphabet, Applied Materials, Intel, Synopsys, Cadence, Mentor Graphics, NVIDIA, and IBM–to address challenges and opportunities for the next half century of electronics progress.
07/24/2018
A once highly manual process, circuit design has been transformed by the advent of electronic design automation (EDA) tools and modular design methodologies. Despite continuing advances in automation technologies, the demand for increasingly complex System-on-Chip (SoC) platforms has shown no sign of slowing. Today’s SoCs incorporate billions of transistors with miles of electrical wiring that are integrated within a tiny chip.