Defense Advanced Research Projects AgencyTagged Content List

Harnessing Complexity

Systems comprising multiple and diverse interactions

Showing 21 results for Complexity + Electronics RSS
For millennia, materials have mattered—so much so that entire eras have been named for them. From the Stone Age to the Bronze Age to the Iron Age and beyond, breakthroughs in materials have defined what was technologically possible and fueled revolutions in fields as diverse as electronics, construction and medicine. Today, DARPA is pursuing the next big advances in this fundamentally important domain.
DARPA published its Young Faculty Award (YFA) 2018 Research Announcement today, seeking proposals in 26 different topic areas—the largest number of YFA research areas ever solicited.
With the official roll out of the Electronics Resurgence Initiative’s latest investments today, DARPA hopes to open new innovation pathways to address impending engineering and economics challenges that, if left unanswered, could challenge what has been a relentless half-century run of progress in microelectronics technology. To maintain healthy forward momentum, the ERI over the next four years will commit hundreds of millions of dollars to nurture research in advanced new materials, circuit design tools, and system architectures. In addition to a half-dozen or so existing DARPA programs, and the largest program in the U.S. that funds basic electronics research at universities, 
The microelectronics community is facing an array of long foreseen obstacles to Moore’s Law, the transistor scaling that has allowed for 50 years of rapid progress in electronics. Current economic, geopolitical, and physics-based complications make the future of the electronics industry uniquely interesting at this moment. To jump-start innovation in the field, DARPA announced in June 2017 that it would coalesce a broad series of programs into the Electronics Resurgence Initiative (ERI).
First announced in June 2017, DARPA’s Electronics Resurgence Initiative (ERI) is a multi-year, upwards of $1.5 billion investment in jumpstarting innovation and collaboration across the U.S. electronics community to address an array of long foreseen challenges to Moore’s Law. To kickoff this community-wide effort, DARPA is hosting its first annual ERI Summit from July 23-25 in San Francisco, CA. The three-day event will bring together leading voices from across the electronics community–including Alphabet, Applied Materials, Intel, Synopsys, Cadence, Mentor Graphics, NVIDIA, and IBM–to address challenges and opportunities for the next half century of electronics progress.